公开(公告)号：US09431589B2

公开(公告)日：2016-08-30

申请号：US12002429

申请日：2007-12-14

申请人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

发明人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

IPC分类号： H01L33/54 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

公开(公告)号：US20090152573A1

公开(公告)日：2009-06-18

申请号：US12002429

申请日：2007-12-14

申请人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

发明人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

摘要翻译： 一种封装的LED器件，其具有纹理化的密封剂，其与其上设置有至少一个LED芯片的安装表面保持一致。 可以在包装之前或期间将可以使用添加剂或减色过程进行纹理化的纹理密封剂施加到LED。 密封剂包括至少一个纹理表面，光从该表面发射。 纹理表面有助于减少密封剂内的全内反射，提高输出分布的提取效率和色温均匀性。 几个芯片可以安装在单个纹理密封剂下面。 可以使用具有不规则表面的模具同时在许多LED上形成多个密封剂。