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公开(公告)号：US20090152573A1
公开(公告)日：2009-06-18
申请号：US12002429
申请日：2007-12-14
申请人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
发明人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
摘要翻译： 一种封装的LED器件，其具有纹理化的密封剂，其与其上设置有至少一个LED芯片的安装表面保持一致。 可以在包装之前或期间将可以使用添加剂或减色过程进行纹理化的纹理密封剂施加到LED。 密封剂包括至少一个纹理表面，光从该表面发射。 纹理表面有助于减少密封剂内的全内反射，提高输出分布的提取效率和色温均匀性。 几个芯片可以安装在单个纹理密封剂下面。 可以使用具有不规则表面的模具同时在许多LED上形成多个密封剂。
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公开(公告)号：US09431589B2
公开(公告)日：2016-08-30
申请号：US12002429
申请日：2007-12-14
申请人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
发明人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
IPC分类号： H01L33/54 , H01L25/075
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
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公开(公告)号：US20110284903A1
公开(公告)日：2011-11-24
申请号：US13164185
申请日：2011-06-20
申请人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, JR.
发明人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, JR.
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要翻译： 用于发光器件封装的基座包括衬底。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。
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公开(公告)号：US08791491B2
公开(公告)日：2014-07-29
申请号：US13164185
申请日：2011-06-20
申请人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
发明人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要翻译： 用于发光器件封装的基座包括衬底。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。
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公开(公告)号：US07964888B2
公开(公告)日：2011-06-21
申请号：US11788001
申请日：2007-04-18
申请人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
发明人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
IPC分类号： H01L33/00
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要翻译： 用于发光器件封装的基座包括矩形基板。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。
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公开(公告)号：US20080258168A1
公开(公告)日：2008-10-23
申请号：US11788001
申请日：2007-04-18
申请人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp
发明人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要翻译： 用于发光器件封装的基座包括矩形基板。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。
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7.发明授权Methods for reducing contamination of semiconductor devices and materials during wafer processing 有权减少晶片加工过程中半导体器件和材料污染的方法公开(公告)号：US07531431B2
公开(公告)日：2009-05-12
申请号：US11437934
申请日：2006-05-19
申请人： Barry Rayfield , Chris Fanelli , Mitch Jackson
发明人： Barry Rayfield , Chris Fanelli , Mitch Jackson
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B28D5/0076 , B28D5/022
摘要： Methods of processing a semiconductor structure including a metal layer in the presence of organic material include flowing an aqueous mixture including an oxidizing agent over the semiconductor structure during processing of the semiconductor structure. Processing the semiconductor structure may include sawing the semiconductor structure and/or scrubbing the semiconductor structure with pressurized water. The oxidizing agent may include a peroxide, such as hydrogen peroxide, or another oxidizing agent.
摘要翻译： 在存在有机材料的情况下处理包括金属层的半导体结构的方法包括在半导体结构的处理期间使包含氧化剂的含水混合物流过半导体结构。 处理半导体结构可以包括锯切半导体结构和/或用加压水洗涤半导体结构。 氧化剂可以包括过氧化物，例如过氧化氢或另一种氧化剂。
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8.发明申请Methods for reducing contamination of semiconductor devices and materials during wafer processing 有权减少晶片加工过程中半导体器件和材料污染的方法公开(公告)号：US20070269980A1
公开(公告)日：2007-11-22
申请号：US11437934
申请日：2006-05-19
申请人： Barry Rayfield , Chris Fanelli , Mitch Jackson
发明人： Barry Rayfield , Chris Fanelli , Mitch Jackson
IPC分类号： H01L21/44
CPC分类号： H01L21/78 , B28D5/0076 , B28D5/022
摘要： Methods of processing a semiconductor structure including a metal layer in the presence of organic material include flowing an aqueous mixture including an oxidizing agent over the semiconductor structure during processing of the semiconductor structure. Processing the semiconductor structure may include sawing the semiconductor structure and/or scrubbing the semiconductor structure with pressurized water. The oxidizing agent may include a peroxide, such as hydrogen peroxide, or another oxidizing agent.
摘要翻译： 在存在有机材料的情况下处理包括金属层的半导体结构的方法包括在半导体结构的处理期间使包含氧化剂的含水混合物流过半导体结构。 处理半导体结构可以包括锯切半导体结构和/或用加压水洗涤半导体结构。 氧化剂可以包括过氧化物，例如过氧化氢或另一种氧化剂。
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