公开(公告)号：US07531895B2

公开(公告)日：2009-05-12

申请号：US11552803

申请日：2006-10-25

申请人： Bernhard Lange ,  William David Boyd

发明人： Bernhard Lange ,  William David Boyd

IPC分类号： H01L23/49 ,  H01L23/495

CPC分类号： H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.

摘要翻译： 一种包括引线框架的集成电路（IC）封装。 引线框架具有欠压部分和引线。 凹陷部分具有被配置为远离安装板的外表面和被配置为面向安装板的内表面。 引线从外表面弯曲，并且每个引线具有联接到IC的第一端和被配置为穿过延伸穿过安装板的多个安装孔中的一个的第二端。 IC耦合到内表面。

公开(公告)号：US07612437B2

公开(公告)日：2009-11-03

申请号：US11656689

申请日：2007-01-23

申请人： Chris Edward Haga ,  Anthony Louis Coyle ,  William David Boyd

发明人： Chris Edward Haga ,  Anthony Louis Coyle ,  William David Boyd

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).

摘要翻译： 在用于制造热增强型半导体器件（200,300）的方法和系统中，封装为通孔单列直插封装（SIP）。 具有用于连接IC管芯（230,330）的管芯焊盘（220,320,420）的引线框架（210,310,410），由第一部分形成的第一多个导电引线（240,340,430） 金属片（432）和设置在作为第一多个导电引线的IC管芯（230,330）的相反侧的金属片（440）的第二部分从金属片冲压。 第一多个导电引线（240,340,430）被布置成单根线，并且能够根据SIP而通孔安装。 金属片（440）的第二部分包括模板（420），以形成呈金属片形式的散热器（260,360）。 散热器（260,360）为由IC芯片（230,330）产生的热提供散热。

公开(公告)号：US20080173990A1

公开(公告)日：2008-07-24

申请号：US11656689

申请日：2007-01-23

申请人： Chris Edward Haga ,  Anthony Louis Coyle ,  William David Boyd

发明人： Chris Edward Haga ,  Anthony Louis Coyle ,  William David Boyd

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).

摘要翻译： 在用于制造热增强型半导体器件（200,300）的方法和系统中，封装为通孔单列直插封装（SIP）。 具有用于连接IC管芯（230,330）的管芯焊盘（220,320,420）的引线框架（210,310,410），由第一部分形成的第一多个导电引线（240,340,430） 金属片（432）和设置在作为第一多个导电引线的IC管芯（230,330）的相反侧的金属片（440）的第二部分从金属片冲压。 第一多个导电引线（240,340,430）被布置成单根线，并且能够根据SIP而通孔安装。 金属片（440）的第二部分包括模板（420），以形成呈金属片形式的散热器（260,360）。 散热器（260,360）为由IC芯片（230,330）产生的热提供散热。