公开(公告)号：USD490555S1

公开(公告)日：2004-05-25

申请号：US29171780

申请日：2002-11-27

Applicant: Bijan Bayat ,  Michael Quan Dinh

Designer： Bijan Bayat ,  Michael Quan Dinh

公开(公告)号：USD490554S1

公开(公告)日：2004-05-25

申请号：US29171707

申请日：2002-11-27

Applicant: Bijan Bayat ,  Michael Quan Dinh

Designer： Bijan Bayat ,  Michael Quan Dinh

公开(公告)号：USD486599S1

公开(公告)日：2004-02-10

申请号：US29171760

申请日：2002-11-27

Applicant: Bijan Bayat ,  Michael Quan Dinh

Designer： Bijan Bayat ,  Michael Quan Dinh

公开(公告)号：USD484628S1

公开(公告)日：2003-12-30

申请号：US29171718

申请日：2002-11-27

Applicant: Bijan Bayat ,  Michael Quan Dinh

Designer： Bijan Bayat ,  Michael Quan Dinh

公开(公告)号：US06191955B1

公开(公告)日：2001-02-20

申请号：US09010015

申请日：1998-01-21

Applicant: Joe Guillot ,  Michael Quan Dinh ,  Bill Roberts ,  Linda M. McLemore

Inventor： Joe Guillot ,  Michael Quan Dinh ,  Bill Roberts ,  Linda M. McLemore

IPC: H01L23053

CPC classification number: H05K5/0095 ,  H05K1/141 ,  H05K1/18 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/0091 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  Y10S257/924 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/4922

Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

Abstract translation: 电子模块包括（a）电气部件和盖子的电气组件。 盖围绕电气部件的电气组件的一部分，以在电气部件的电气组件的一部分和盖之间形成凹穴。 所述盖具有至少一个侧壁，所述至少一个侧壁中的每一个具有端部，至少一个侧壁中的至少一个侧壁中的至少一个侧壁邻近地定位至少一个电引线并且具有位于其末端的至少一个凹口，所述凹穴填充有密封剂 。 一种方法包括提供盖子并用盖子填充盖子，将电气部件的电气组件放置在填充有预选量的密封剂的盖中，并允许电气组件座位到适当的深度。

公开(公告)号：US5749143A

公开(公告)日：1998-05-12

申请号：US695443

申请日：1996-08-12

Applicant: Joe Guillot ,  Michael Quan Dinh ,  Bill Roberts ,  Linda M. McLemore

Inventor： Joe Guillot ,  Michael Quan Dinh ,  Bill Roberts ,  Linda M. McLemore

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K5/00 ,  H05K3/30

CPC classification number: H05K5/0095 ,  H05K1/18 ,  H05K3/284 ,  H05K5/0091 ,  H05K1/141 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K3/3447 ,  Y10S257/924 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/4922

Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

Abstract translation: 电子模块包括（a）电气部件和盖子的电气组件。 盖围绕电气部件的电气组件的一部分以在电气部件的电气组件的一部分和盖之间形成凹穴。 所述盖具有至少一个侧壁，所述至少一个侧壁中的每一个具有端部，至少一个侧壁中的至少一个侧壁中的至少一个侧壁邻近地定位到至少一个电引线并且具有位于其末端的至少一个凹口，所述凹穴填充有密封剂 。 一种方法包括提供盖子并用盖子填充盖子，将电气部件的电气组件放置在填充有预选量的密封剂的盖中，并允许电气组件座位到适当的深度。