公开(公告)号：US20230002651A1

公开(公告)日：2023-01-05

申请号：US17782181

申请日：2020-12-04

Applicant: Bostik, Inc.

Inventor： Kathleen M. Davis ,  Michael D. Vitrano ,  Patrick J. Czaplewski ,  Lauren M. Rohde

IPC: C09J153/00 ,  C09J5/06 ,  C08F220/06 ,  C08F210/02

Abstract: A hot melt pressure sensitive adhesive composition comprises: (a) a block copolymer comprising a first polymer block comprising an ethylene residue and a second polymer block comprising a C1 to C4 alkyl acrylate residue, wherein the block copolymer has a melt index as measured in accordance with ASTM D1238 of between about 0.1 and about 250 g/10 min; (b) a tackifying resin; and (c) a plasticizer. A method for making a laminate comprises the steps of: applying the hot melt pressure sensitive adhesive composition of the invention in a molten state to a primary substrate and allowing the adhesive to cool to form a bond with said primary substrate. Certain adhesives the invention perform comparably to certain styrene block copolymer adhesives, but provides an alternative polymer source.

公开(公告)号：US20160215176A1

公开(公告)日：2016-07-28

申请号：US15004312

申请日：2016-01-22

Applicant: Bostik, Inc.

Inventor： Monina D. Kanderski ,  Michael D. Vitrano

IPC: C09J123/08 ,  B32B27/08 ,  B32B27/32

CPC classification number: C09J123/0815 ,  B32B27/08 ,  B32B27/32 ,  B32B27/327 ,  B32B2250/242 ,  B32B2439/70 ,  C08K5/005 ,  C08L91/06 ,  C08L2203/162

Abstract: A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.0 pound per inch in order to meet the sealing performance requirements for packaging food and other consumer goods.

Abstract translation: 基于茂金属催化聚烯烃聚合物，增粘树脂，蜡和其他任选添加剂的共混物的包装应用的低活化温度热熔粘合剂。 为了达到适用于挤出热封应用的高粘度，本发明的粘合剂组合物高度负载聚合物，因此在300°F的温度下应该具有约50,000厘泊或更高的粘度。因此， 热熔粘合剂组合物含有约50％至约90％重量的茂金属催化的聚烯烃聚合物，约5％至约50％重​​量的增粘树脂，约0.5％至约40％重量的蜡，约0.1％至 约5重量％的稳定剂或抗氧化剂，和0重量％至约25重量％的任选添加剂。 热熔粘合剂组合物必须具有约160°F或更低的活化温度，并提供约1.0磅/英寸的最小剥离力，以满足包装食品和其它消费品的密封性能要求。

公开(公告)号：US20160002508A1

公开(公告)日：2016-01-07

申请号：US14789727

申请日：2015-07-01

Applicant: Bostik, Inc.

Inventor： Monina D. Kanderski ,  Michael D. Vitrano

IPC: C09J153/00 ,  B42D15/00 ,  B42D15/04 ,  C09J7/04

CPC classification number: B42D15/04 ,  B42D15/0093 ,  C08L23/0815 ,  C08L91/00 ,  C08L91/06 ,  C09J153/025

Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear. In addition, the presence of the secondary polymer allows additional oil absorption into the polymer, thus preventing oil from staining the substrates or surfaces without significantly increasing the viscosity.

Abstract translation: 用于邮寄应用的非压敏热熔粘合剂使用具有氢化中间嵌段的苯乙烯嵌段共聚物（SBC）作为组合物中的主要聚合物。 粘合剂包含约10重量％至约50重量％的SBC，约2重量％至约30重量％的作为组合物中的第二聚合物的聚烯烃聚合物，约10重量％至约70重量％的合适的增塑剂 ，约0％至约30％重量的蜡，约0％至约50％重​​量的一种或多种增粘树脂，约0.1％至约4％重量的稳定剂和约0％至约3％ 重量的辅助添加剂，使得组合物的粘度在163℃下等于或小于约10000cP。制剂平衡了粘合剂失效所需的内聚力和粘合强度，从而防止纸张撕裂。 此外，二次聚合物的存在允许另外的油吸收到聚合物中，从而防止油污染基底或表面而不显着增加粘度。

公开(公告)号：US11661537B2

公开(公告)日：2023-05-30

申请号：US16562748

申请日：2019-09-06

Applicant: BOSTIK, INC.

Inventor： Monina D. Kanderski ,  Michael D. Vitrano ,  David P. Keuler ,  Deepa Puthanparambil ,  Jacqueline M. Lambert ,  Brian J. Morrow

IPC: C09J167/04 ,  B65D6/00 ,  C09J5/06 ,  C09J141/00 ,  C08K5/00 ,  C08K5/053 ,  C08K5/092 ,  C08K5/12

CPC classification number: C09J167/04 ,  B65D13/04 ,  C09J5/06 ,  C09J141/00 ,  C08K5/0016 ,  C08K5/053 ,  C08K5/092 ,  C08K5/12

Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

公开(公告)号：US20180244962A1

公开(公告)日：2018-08-30

申请号：US15966592

申请日：2018-04-30

Applicant: Bostik, Inc.

Inventor： Monina D. Kanderski ,  Michael D. Vitrano

IPC: C09J123/20 ,  C08K5/134 ,  C09J123/08 ,  C08L51/06 ,  C08L91/00

CPC classification number: C09J123/20 ,  C08K5/1345 ,  C08L51/06 ,  C08L91/00 ,  C08L2314/06 ,  C09J123/0815

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

公开(公告)号：US20150087760A1

公开(公告)日：2015-03-26

申请号：US14497175

申请日：2014-09-25

Applicant: Bostik, Inc.

Inventor： Monina D. Kanderski ,  Michael D. Vitrano

IPC: C09J123/20 ,  C08K5/134

CPC classification number: C09J123/20 ,  C08K5/1345 ,  C08L51/06 ,  C08L91/00 ,  C08L2314/06 ,  C09J123/0815

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

Abstract translation: 含有官能化聚合物的热熔粘合剂组合物，即接枝有马来酸酐的茂金属催化的聚烯烃弹性体，以及非官能化的第二聚合物，即熔融指数等于或大于等于或小于1的熔融金属催化的无规或嵌段聚烯烃弹性体 15，软化点为95℃以上的第一增粘树脂和蜡。 组合物可任选地包括软化点等于或高于115℃的芳香族增强树脂和增塑剂。 这些热熔体在刚性包装，热填充包装和瓶子标签等应用中提供优异的热粘性，优异的粘合性，柔韧性和高于150°F的耐热性。

公开(公告)号：US10081212B2

公开(公告)日：2018-09-25

申请号：US14789727

申请日：2015-07-01

Applicant: Bostik, Inc.

Inventor： Monina D. Kanderski ,  Michael D. Vitrano

IPC: C09J153/00 ,  C09J153/02 ,  B42D15/04 ,  B42D15/00

CPC classification number: B42D15/04 ,  B42D15/0093 ,  C08L23/0815 ,  C08L91/00 ,  C08L91/06 ,  C09J153/025

Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear. In addition, the presence of the secondary polymer allows additional oil absorption into the polymer, thus preventing oil from staining the substrates or surfaces without significantly increasing the viscosity.

公开(公告)号：US09982171B2

公开(公告)日：2018-05-29

申请号：US14497175

申请日：2014-09-25

Applicant: Bostik, Inc.

Inventor： Monina D. Kanderski ,  Michael D. Vitrano

IPC: C09J123/20 ,  C08K5/134 ,  C09J123/08

CPC classification number: C09J123/20 ,  C08K5/1345 ,  C08L51/06 ,  C08L91/00 ,  C08L2314/06 ,  C09J123/0815

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.