Selective bonding for forming a microvalve
    2.
    发明授权
    Selective bonding for forming a microvalve 有权
    用于形成微型阀的选择性粘合

    公开(公告)号:US07803281B2

    公开(公告)日:2010-09-28

    申请号:US10590954

    申请日:2005-02-15

    IPC分类号: C03C15/00

    摘要: A method for forming a micromachined device is disclosed that includes providing a first silicon layer and a second silicon layer. A coating is provided on a first portion of the first layer. The first layer and the second layer are bonded to each other to form a micromachined device, the coating being effective to prevent the coated first portion of the first layer from bonding to the second layer.

    摘要翻译: 公开了一种用于形成微加工装置的方法,其包括提供第一硅层和第二硅层。 在第一层的第一部分上提供涂层。 第一层和第二层彼此结合以形成微加工装置,该涂层有效地防止第一层的涂覆的第一部分粘合到第二层。