公开(公告)号：US09282881B2

公开(公告)日：2016-03-15

申请号：US13571998

申请日：2012-08-10

申请人： Brahm Pal Singh ,  Katsuhiro Kanamori ,  Masao Hiramoto

发明人： Brahm Pal Singh ,  Katsuhiro Kanamori ,  Masao Hiramoto

IPC分类号： A61B1/045 ,  A61B1/00 ,  G03B15/05 ,  G03B35/02 ,  H04N13/00 ,  H04N13/02 ,  H04N5/225

CPC分类号： A61B1/045 ,  A61B1/00193 ,  G03B15/05 ,  G03B35/02 ,  G03B2215/05 ,  H04N13/161 ,  H04N13/218 ,  H04N13/254 ,  H04N2005/2255

摘要： An exemplary 3D image shooting apparatus comprises: a polarized light source; an image capturing section that sequentially captures an image of the object that is being illuminated with each of plane polarized light rays, and an image processor. The image capturing section includes: a lens; an image sensor; and an incoming light transmitting section which has a transparent area and a plurality of polarization filter areas. The polarization filter areas are arranged outside of the transparent area, generally have a concentric ring shape, and include left and right filter areas so that their polarization transmission axis directions define an angle α (0

摘要翻译： 示例性3D图像拍摄装置包括：偏振光源; 图像捕获部分，其顺序地捕获被每个平面偏振光照射的对象的图像和图像处理器。 图像拍摄部分包括：透镜; 图像传感器; 以及具有透明区域和多个偏振滤光器区域的入射光发射部分。 偏振滤光器区域布置在透明区域的外侧，通常具有同心环形状，并且包括左右滤光器区域，使得其偏振透射轴方向限定角度α（0 <α<90度）。 图像处理部分通过透明区域传播的光和通过多个偏振滤光器区域传输的光产生多个图像。

公开(公告)号：US07232704B2

公开(公告)日：2007-06-19

申请号：US11080642

申请日：2005-03-16

申请人： Brahm Pal Singh

发明人： Brahm Pal Singh

IPC分类号： H01L21/44

CPC分类号： H01L24/95 ,  H01L25/50 ,  H01L27/14618 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： Prepared first are a mounting substrate having, on its principal surface, a plurality of recesses which correspond in plan configuration to a plurality of functional chips, and a flat plate disposed on the mounting substrate and having a plurality of confinement regions formed of openings, each of which exposes one of the recesses and a peripheral portion of the recess and is designed to confine one of the functional chips. Next, the functional chips are put into the respective confinement regions on the mounting substrate. The mounting substrate having the functional chips thereon is then immersed in a fluid together with the flat plate. Subsequently, the flat plate immersed in the fluid is displaced (vibrated) with the mounting substrate fixed, thereby fitting the functional chips into the recesses in the mounting substrate.

摘要翻译： 首先制备的安装基板在其主表面上具有在平面结构中对应于多个功能芯片的多个凹槽，以及设置在安装基板上并具有多个由开口形成的限制区域的平板， 其中露出凹部中的一个和凹部的周边部分并被设计成限制功能芯片之一。 接下来，将功能芯片放入安装基板上的各个限制区域。 然后将其上具有功能芯片的安装基板与平板一起浸入流体中。 随后，浸渍在流体中的平板被固定在安装基板上（振动），从而将功能芯片装配到安装基板的凹部中。