公开(公告)号：US20230282478A1

公开(公告)日：2023-09-07

申请号：US18177546

申请日：2023-03-02

Applicant: Brewer Science, Inc.

Inventor： Daniel Patrick Sweat ,  Jakub Koza ,  Jamie Storie

IPC: H01L21/027 ,  C09D163/04 ,  C08F265/04 ,  H01L21/02 ,  H01L21/308 ,  H01L21/311

CPC classification number: H01L21/0276 ,  C08F265/04 ,  C09D163/04 ,  H01L21/02164 ,  H01L21/02186 ,  H01L21/3081 ,  H01L21/3086 ,  H01L21/31144 ,  H01L21/31111 ,  H01L21/31133

Abstract: Adhesive additives are disclosed that enhance spin-on carbon (SOC) resistance to SC-1 wet etch. The additives can be formed by reacting a polymer or oligomer (such as an adhesion polymer or adhesion oligomer) with 3,4,5-triacetoxybenzoic acid (TABA). When added to standard SOC layers or used as a primer between an SOC layer and substrate, these additives enhance the adhesion of the SOC layer to TiN and other substrates and reduce undercut during SC-1 wet etch.