公开(公告)号：US20240030063A1

公开(公告)日：2024-01-25

申请号：US18354433

申请日：2023-07-18

Applicant: Brewer Science, Inc.

Inventor： Daniel Patrick Sweat ,  Shannon Brown ,  Joyce A. Lowes

IPC: H01L21/768 ,  G03F7/027 ,  H01L23/528

CPC classification number: H01L21/76837 ,  G03F7/027 ,  H01L21/7682 ,  H01L23/5283

Abstract: Thermally decomposable gap-fill materials are disclosed that fill small features and are completely removed by a high-temperature bake after processing. These materials are self-crosslinkable polymers. Potential applications of these materials include use as sacrificial gap-fill materials for creating air gaps, as well as protection of high-aspect-ratio or other delicate microelectronic features during processing steps.