公开(公告)号：US11574805B2

公开(公告)日：2023-02-07

申请号：US16865159

申请日：2020-05-01

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Reuben Chacko

IPC: H01L21/02 ,  C08F220/68 ,  H01L23/31 ,  H01L23/29 ,  C09D133/16

Abstract: Materials and methods for modifying semiconducting substrate surfaces in order to dramatically change surface energy are provided. Preferred materials include perfluorocarbon molecules or polymers with various functional groups. The functional groups (carboxylic acids, hydroxyls, epoxies, aldehydes, and/or thiols) attach materials to the substrate surface by physical adsorption or chemical bonding, while the perfluorocarbon components contribute to low surface energy. Utilization of the disclosed materials and methods allows rapid transformation of surface properties from hydrophilic to hydrophobic (water contact angle 120° and PGMEA contact angle) 70°. Selective liquiphobic modifications of copper over Si/SiOx, TiOx over Si/SiOx, and SiN over SiOx are also demonstrated.

公开(公告)号：US20220181140A1

公开(公告)日：2022-06-09

申请号：US17682175

申请日：2022-02-28

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Reuben Chacko

IPC: H01L21/02 ,  C08F220/68 ,  H01L23/31 ,  H01L23/29 ,  C09D133/16

Abstract: Materials and methods for modifying semiconducting substrate surfaces in order to dramatically change surface energy are provided. Preferred materials include perfluorocarbon molecules or polymers with various functional groups. The functional groups (carboxylic acids, hydroxyls, epoxies, aldehydes, and/or thiols) attach materials to the substrate surface by physical adsorption or chemical bonding, while the perfluorocarbon components contribute to low surface energy. Utilization of the disclosed materials and methods allows rapid transformation of surface properties from hydrophilic to hydrophobic (water contact angle 120° and PGMEA contact angle) 70°. Selective liquiphobic modifications of copper over Si/SiOx, TiOx over Si/SiOx, and SiN over SiOx are also demonstrated.

公开(公告)号：US20240030063A1

公开(公告)日：2024-01-25

申请号：US18354433

申请日：2023-07-18

Applicant: Brewer Science, Inc.

Inventor： Daniel Patrick Sweat ,  Shannon Brown ,  Joyce A. Lowes

IPC: H01L21/768 ,  G03F7/027 ,  H01L23/528

CPC classification number: H01L21/76837 ,  G03F7/027 ,  H01L21/7682 ,  H01L23/5283

Abstract: Thermally decomposable gap-fill materials are disclosed that fill small features and are completely removed by a high-temperature bake after processing. These materials are self-crosslinkable polymers. Potential applications of these materials include use as sacrificial gap-fill materials for creating air gaps, as well as protection of high-aspect-ratio or other delicate microelectronic features during processing steps.

公开(公告)号：US11768435B2

公开(公告)日：2023-09-26

申请号：US16671426

申请日：2019-11-01

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Carissa Jones

IPC: G03F7/004 ,  G03F7/095 ,  C08F212/08 ,  C08F220/28 ,  G03F7/34 ,  G03F7/16 ,  C08F220/38

CPC classification number: G03F7/0955 ,  C08F212/08 ,  C08F220/281 ,  C08F220/382 ,  G03F7/0045 ,  G03F7/165 ,  G03F7/168 ,  G03F7/34

Abstract: Materials and methods to immobilize photoacid generators on semiconducting substrates are provided. PAG-containing monomers are copolymerized with monomers to allow the polymer to bind to a surface, and optionally copolymerized with monomers to enhance solubility to generate PAG-containing polymers. The PAG-containing monomers can be coated onto a surface, where the immobilized PAGs can then be used to pattern materials coated on top of the immobilized PAGs, allowing direct patterning without the use of a photoresist, thereby reducing process steps and cost. The disclosed materials and processes can be used to produce conformal coatings of controlled thicknesses.

公开(公告)号：US20250096005A1

公开(公告)日：2025-03-20

申请号：US18890144

申请日：2024-09-19

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Daniel Patrick Sweat

IPC: H01L21/3105 ,  H01L21/02 ,  H01L21/027 ,  H01L21/32

Abstract: Compositions and methods for global planarization of microelectronic substrates are provided. The methods include applying a crosslinking modifier composition to the surface of a substrate, or to any intermediate layer(s) on the substrate surface. A planarizing material can then be applied to the crosslinking modifier layer, which influences the degree of crosslinking in the planarizing layer. Depending on the specific topography of the underlying substrate (or intermediate layer), different amounts of planarizing material are removed during a subsequent develop back step, thereby eliminating bias that usually exists between regions of varying topographic density. The result is an effective global planarization method that is both time and cost efficient.

公开(公告)号：US20250068077A1

公开(公告)日：2025-02-27

申请号：US18813295

申请日：2024-08-23

Applicant: Brewer Science, Inc.

Inventor： Daniel Patrick Sweat ,  Joyce A. Lowes

IPC: G03F7/11 ,  C07C67/313 ,  C07C69/734 ,  C07D251/32 ,  C08F8/14 ,  C08F38/00 ,  C08G59/14 ,  G03F7/20

Abstract: A novel method to prepare crosslinked thin films without the use of catalysts is disclosed. Propiolic acid is grafted to a glycidyl or epoxy group using a phosphonium catalyst under mild conditions to yield a propiolate ester. The propiolate ester is thermally crosslinkable (and the polymer film rendered insoluble) at temperatures as low as 120° C., and some embodiments may undergo photoinduced crosslinking upon exposure to DUV light. The resulting crosslinked films are equivalent or better in stability to acid-catalyzed epoxide crosslinked films and can be used for a multitude of different applications.

公开(公告)号：US12057308B2

公开(公告)日：2024-08-06

申请号：US17682175

申请日：2022-02-28

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Reuben Chacko

IPC: H01L21/02 ,  C08F220/68 ,  C09D133/16 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/0212 ,  C08F220/68 ,  C09D133/16 ,  H01L21/02282 ,  H01L23/293 ,  H01L23/3171

Abstract: Materials and methods for modifying semiconducting substrate surfaces in order to dramatically change surface energy are provided. Preferred materials include perfluorocarbon molecules or polymers with various functional groups. The functional groups (carboxylic acids, hydroxyls, epoxies, aldehydes, and/or thiols) attach materials to the substrate surface by physical adsorption or chemical bonding, while the perfluorocarbon components contribute to low surface energy. Utilization of the disclosed materials and methods allows rapid transformation of surface properties from hydrophilic to hydrophobic (water contact angle 120° and PGMEA contact angle) 70°. Selective liquiphobic modifications of copper over Si/SiOx, TiOx over Si/SiOx, and SiN over SiOx are also demonstrated.

公开(公告)号：US20210082683A1

公开(公告)日：2021-03-18

申请号：US16865159

申请日：2020-05-01

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Reuben Chacko

IPC: H01L21/02 ,  C08F220/68 ,  C09D133/16 ,  H01L23/29 ,  H01L23/31

Abstract: Materials and methods for modifying semiconducting substrate surfaces in order to dramatically change surface energy are provided. Preferred materials include perfluorocarbon molecules or polymers with various functional groups. The functional groups (carboxylic acids, hydroxyls, epoxies, aldehydes, and/or thiols) attach materials to the substrate surface by physical adsorption or chemical bonding, while the perfluorocarbon components contribute to low surface energy. Utilization of the disclosed materials and methods allows rapid transformation of surface properties from hydrophilic to hydrophobic (water contact angle 120° and PGMEA contact angle) 70°. Selective liquiphobic modifications of copper over Si/SiOx, TiOx over Si/SiOx, and SiN over SiOx are also demonstrated.