公开(公告)号：US09865490B2

公开(公告)日：2018-01-09

申请号：US15332581

申请日：2016-10-24

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine ,  Baron Huang ,  Andrew Wong

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/50 ,  C08G77/14 ,  C08G77/20 ,  C08G77/18 ,  C08G77/26 ,  C09J145/00 ,  C09J183/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  C09J5/06

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B9/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C09J5/06 ,  C09J145/00 ,  C09J183/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  H01L21/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.