公开(公告)号：US20140183748A1

公开(公告)日：2014-07-03

申请号：US13742961

申请日：2013-01-16

Applicant: BROADCOM CORPORATION

Inventor： Lynn Ooi ,  Sampath K. V. Karikalan

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L22/32 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments described herein generally relate to connections for integrated circuit (IC) dies. For example, in an embodiment an integrated circuit (IC) die is provided. The IC die includes a plurality of clusters of pads formed on a surface of the IC die, each cluster being associated with a respective circuit formed in the IC die. Each cluster includes a plurality of micropads each electrically coupled to the circuit associated with the cluster through a respective via and a sacrificial pad coupled to the circuit through the plurality of micropads, the sacrificial pad being larger than each of the micropads.

Abstract translation: 本文描述的实施例通常涉及用于集成电路（IC）管芯的连接。 例如，在一个实施例中，提供集成电路（IC）管芯。 IC芯片包括形成在IC芯片的表面上的多个焊盘群，每个簇与形成在IC管芯中的相应电路相关联。 每个集群包括多个微型焊盘，每个微焊盘通过相应的通孔电耦合到与集束相关的电路，以及通过多个微焊盘耦合到电路的牺牲焊盘，所述牺牲焊盘大于每个微焊盘。

公开(公告)号：US08907488B2

公开(公告)日：2014-12-09

申请号：US13742961

申请日：2013-01-16

Applicant: Broadcom Corporation

Inventor： Lynn Ooi ,  Sampath K V Karikalan

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L22/32 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments described herein generally relate to connections for integrated circuit (IC) dies. For example, in an embodiment an integrated circuit (IC) die is provided. The IC die includes a plurality of clusters of pads formed on a surface of the IC die, each cluster being associated with a respective circuit formed in the IC die. Each cluster includes a plurality of micropads each electrically coupled to the circuit associated with the cluster through a respective via and a sacrificial pad coupled to the circuit through the plurality of micropads, the sacrificial pad being larger than each of the micropads.

Abstract translation: 本文描述的实施例通常涉及用于集成电路（IC）管芯的连接。 例如，在一个实施例中，提供集成电路（IC）管芯。 IC芯片包括形成在IC芯片的表面上的多个焊盘群，每个簇与形成在IC管芯中的相应电路相关联。 每个集群包括多个微型焊盘，每个微焊盘通过相应的通孔电耦合到与集束相关的电路，以及通过多个微焊盘耦合到电路的牺牲焊盘，所述牺牲焊盘大于每个微焊盘。

公开(公告)号：US09349697B2

公开(公告)日：2016-05-24

申请号：US14563636

申请日：2014-12-08

Applicant: Broadcom Corporation

Inventor： Lynn Ooi ,  Sampath K. V. Karikalan

IPC: H01L23/00 ,  H01L21/66

CPC classification number: H01L24/06 ,  H01L22/32 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments described herein generally relate to connections for integrated circuit (IC) dies. For example, in an embodiment an integrated circuit (IC) die is provided. The IC die includes a plurality of clusters of pads formed on a surface of the IC die, each cluster being associated with a respective circuit formed in the IC die. Each cluster includes a plurality of micropads each electrically coupled to the circuit associated with the cluster through a respective via and a sacrificial pad coupled to the circuit through the plurality of micropads, the sacrificial pad being larger than each of the micropads.

Abstract translation: 本文描述的实施例通常涉及用于集成电路（IC）管芯的连接。 例如，在一个实施例中，提供集成电路（IC）管芯。 IC芯片包括形成在IC芯片的表面上的多个焊盘群，每个簇与形成在IC管芯中的相应电路相关联。 每个集群包括多个微型焊盘，每个微焊盘通过相应的通孔电耦合到与集束相关的电路，以及通过多个微焊盘耦合到电路的牺牲焊盘，所述牺牲焊盘大于每个微焊盘。

公开(公告)号：US20150221603A1

公开(公告)日：2015-08-06

申请号：US14563636

申请日：2014-12-08

Applicant: Broadcom Corporation

Inventor： Lynn Ooi ,  Sampath K.V. Karikalan

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L22/32 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments described herein generally relate to connections for integrated circuit (IC) dies. For example, in an embodiment an integrated circuit (IC) die is provided. The IC die includes a plurality of clusters of pads formed on a surface of the IC die, each cluster being associated with a respective circuit formed in the IC die. Each cluster includes a plurality of micropads each electrically coupled to the circuit associated with the cluster through a respective via and a sacrificial pad coupled to the circuit through the plurality of micropads, the sacrificial pad being larger than each of the micropads.

Abstract translation: 本文描述的实施例通常涉及用于集成电路（IC）管芯的连接。 例如，在一个实施例中，提供集成电路（IC）管芯。 IC芯片包括形成在IC芯片的表面上的多个焊盘群，每个簇与形成在IC管芯中的相应电路相关联。 每个集群包括多个微型焊盘，每个微焊盘通过相应的通孔电耦合到与集束相关的电路，以及通过多个微焊盘耦合到电路的牺牲焊盘，所述牺牲焊盘大于每个微焊盘。