Abstract:
Semiconductor devices are provided that use both silicon on insulator region and bulk region of a fully depleted silicon on insulator (FDSOI) device. For example, a semiconductor device includes a drain region that is disposed above a first type well and a first drain extension region that is disposed above the first type well and laterally spaced apart from the drain region. The semiconductor device further includes a second drain extension region that is disposed above the first type well and is laterally spaced apart from the drain region and the first drain extension region. The semiconductor device further includes a source region disposed above a second type well and laterally spaced apart from the second drain extension.
Abstract:
A field effect transistor (FET) with raised source/drain region of the device so as to constrain the epitaxial growth of the drain region. The arrangement of the spacer layer is created by depositing a photoresist over the extended drain layer during a photolithographic process.
Abstract:
A field-effect transistor (FET) based one-time programmable (OTP) device is discussed. The OTP device includes a fin structure, a gate structure, a first contact region, and a second contact region. The first contact region includes an insulating region and a conductive region and is configured to be electrically isolated from the gate structure. While, the second contact region includes the conductive region and is configured to be electrically coupled to at least a portion of the gate structure. The OTP device is configured to be programmed by disintegration of the insulating region in response to a first voltage being applied to the first contact and a second voltage being applied to the second contact region simultaneously, where the second voltage is higher than the first voltage by a threshold value.