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公开(公告)号:US12002696B2
公开(公告)日:2024-06-04
申请号:US17362599
申请日:2021-06-29
Applicant: Brooks Automation, Inc.
Inventor: Radik Sunugatov , Roy R. Wang , Karl Shieh , Justo Graciano , Austin Wise , Caspar Hansen , Erick Pastor
IPC: H01L21/67 , G06T7/13 , H01L21/673 , H01L21/677
CPC classification number: H01L21/67265 , G06T7/13 , H01L21/6732 , H01L21/67778
Abstract: A semiconductor wafer mapping apparatus comprising a frame forming a wafer load opening communicating with a load station for a substrate carrier disposed to hold more than one wafers vertically distributed in the substrate carrier for loading through the wafer load opening, a movable arm movably mounted to the frame so as to move relative to the wafer load opening and having at least one end effector movably mounted to the movable arm to load wafers from the substrate carrier through the wafer load opening, an image acquisition system including an array of cameras arranged on a common support and each camera fixed with respect to the common support that is static with respect to each camera of the array of cameras, wherein each respective camera is positioned with a field of view disposed to view through the wafer load opening with the common support positioned by the movable arm.
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公开(公告)号:US20210407831A1
公开(公告)日:2021-12-30
申请号:US17362599
申请日:2021-06-29
Applicant: Brooks Automation, Inc.
Inventor: Radik Sunugatov , Roy R. Wang , Karl Shieh , Justo Graciano , Austin Wise , Caspar Hansen , Erick Pastor
IPC: H01L21/67 , H01L21/673 , H01L21/677 , G06T7/13
Abstract: A semiconductor wafer mapping apparatus comprising a frame forming a wafer load opening communicating with a load station for a substrate carrier disposed to hold more than one wafers vertically distributed in the substrate carrier for loading through the wafer load opening, a movable arm movably mounted to the frame so as to move relative to the wafer load opening and having at least one end effector movably mounted to the movable arm to load wafers from the substrate carrier through the wafer load opening, an image acquisition system including an array of cameras arranged on a common support and each camera fixed with respect to the common support that is static with respect to each camera of the array of cameras, wherein each respective camera is positioned with a field of view disposed to view through the wafer load opening with the common support positioned by the movable arm.
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