公开(公告)号：US11676845B2

公开(公告)日：2023-06-13

申请号：US17362565

申请日：2021-06-29

Applicant: Brooks Automation, Inc.

Inventor： Justo Graciano ,  Helen Hwang ,  Erick Pastor

IPC: B25J9/16 ,  H01L21/68 ,  H01L21/67

CPC classification number: H01L21/681 ,  B25J9/1697 ,  H01L21/67161

Abstract: An automatic teaching system for a substrate processing apparatus, the automatic teaching system comprising a frame having a workpiece load station with a predetermined load station reference location, a robot transport mounted to the frame and having a movable transport arm with an end effector having a predetermined end effector reference location, and a drive section driving the movable transport arm in at least one degree of freedom motion relative to the frame, a machine vision system including both at least one fixed imaging sensor and at least one movable imaging sensor removably connected to the frame and configured to image at least one target of the machine vision system, a load jig disposed for removable engagement with the workpiece load station, with both the at least one fixed imaging sensor and the at least one movable imaging sensor mounted to the load jig, the fixed imaging sensor.

公开(公告)号：US12002696B2

公开(公告)日：2024-06-04

申请号：US17362599

申请日：2021-06-29

Applicant: Brooks Automation, Inc.

Inventor： Radik Sunugatov ,  Roy R. Wang ,  Karl Shieh ,  Justo Graciano ,  Austin Wise ,  Caspar Hansen ,  Erick Pastor

IPC: H01L21/67 ,  G06T7/13 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67265 ,  G06T7/13 ,  H01L21/6732 ,  H01L21/67778

Abstract: A semiconductor wafer mapping apparatus comprising a frame forming a wafer load opening communicating with a load station for a substrate carrier disposed to hold more than one wafers vertically distributed in the substrate carrier for loading through the wafer load opening, a movable arm movably mounted to the frame so as to move relative to the wafer load opening and having at least one end effector movably mounted to the movable arm to load wafers from the substrate carrier through the wafer load opening, an image acquisition system including an array of cameras arranged on a common support and each camera fixed with respect to the common support that is static with respect to each camera of the array of cameras, wherein each respective camera is positioned with a field of view disposed to view through the wafer load opening with the common support positioned by the movable arm.

公开(公告)号：US20210407831A1

公开(公告)日：2021-12-30

申请号：US17362599

申请日：2021-06-29

Applicant: Brooks Automation, Inc.

Inventor： Radik Sunugatov ,  Roy R. Wang ,  Karl Shieh ,  Justo Graciano ,  Austin Wise ,  Caspar Hansen ,  Erick Pastor

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  G06T7/13

Abstract: A semiconductor wafer mapping apparatus comprising a frame forming a wafer load opening communicating with a load station for a substrate carrier disposed to hold more than one wafers vertically distributed in the substrate carrier for loading through the wafer load opening, a movable arm movably mounted to the frame so as to move relative to the wafer load opening and having at least one end effector movably mounted to the movable arm to load wafers from the substrate carrier through the wafer load opening, an image acquisition system including an array of cameras arranged on a common support and each camera fixed with respect to the common support that is static with respect to each camera of the array of cameras, wherein each respective camera is positioned with a field of view disposed to view through the wafer load opening with the common support positioned by the movable arm.