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公开(公告)号：US20160118290A1
公开(公告)日：2016-04-28
申请号：US14893752
申请日：2014-06-26
IPC分类号： H01L21/687 , H01L21/67
CPC分类号： H01L21/68728 , H01L21/02057 , H01L21/30604 , H01L21/67023 , H01L21/6719
摘要： A processing chamber includes a base, a cover, and grippers. The base includes a body, a mating surface, an inner zone cavity extending into the body, a divider substantially surrounding the inner zone cavity, and an outer zone cavity extending into the body and substantially surrounding the divider. The cover includes a mating surface that contacts the body mating surface when the processing chamber is closed. The grippers hold the wafer in the inner zone cavity when the processing chamber is closed.
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公开(公告)号：US20140352738A1
公开(公告)日：2014-12-04
申请号：US14289017
申请日：2014-05-28
IPC分类号： H01L21/67
CPC分类号： H01L21/67051
摘要： A liquid dispenser for a wafer processing system includes a supply tube with an inlet at one end and an outlet at the other end. Attached to the supply tube at the outlet end is a liquid reservoir. The liquid reservoir has a dispensing plate that has an outlet for dispensing liquid onto a wafer. There is also a dispensing valve for controlling the dispensing of the liquid.
摘要翻译： 用于晶片处理系统的液体分配器包括在一端具有入口并在另一端具有出口的供给管。 在出口端连接到供应管是液体储存器。 液体储存器具有分配板，该分配板具有用于将液体分配到晶片上的出口。 还有一个用于控制液体分配的分配阀。
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公开(公告)号：US20140352735A1
公开(公告)日：2014-12-04
申请号：US14288991
申请日：2014-05-28
IPC分类号： H01L21/67
CPC分类号： H01L21/67051
摘要： A wafer cleaning method includes dispensing liquid chemicals at two flow rates to start a chemical reaction, with the second flow rate being lower than the first. The method also includes dispensing liquid waters at two flow rates to stop a chemical reaction, with the second flow rate being lower than the first.
摘要翻译： 晶片清洗方法包括以两个流速分配液体化学品以开始化学反应，第二流量低于第一流量。 该方法还包括以两个流速分配液体水以停止化学反应，第二流量低于第一流量。
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