摘要:
The invention provides a multilayer chip capacitor reduced in ESL. A capacitor body has a plurality of dielectric layers stacked in a thickness direction. A plurality of first and second internal electrodes are separated from one another by the dielectric layers within the capacitor body. Each of the first internal electrodes opposes each of the second internal electrodes. Each of the first and second internal electrodes includes at least two leads extending toward any side of the capacitor body. Also, a plurality of external electrodes are formed on an outer surface of the capacitor body and connected to the internal electrodes via the leads. Further, vertically adjacent ones of the leads having the same polarity extend in different directions at a predetermined angle. The leads of the first and second internal electrodes are disposed adjacent to and alternate with those of the second internal electrodes.
摘要:
A multilayer chip capacitor, which reduces ESL generated due to current flowing through external electrodes and assures an improved mechanical strength. The multilayer chip capacitor includes an upper dummy layer and a lower dummy layer; a plurality of internal electrodes interposed between the upper and lower dummy layers; and external electrodes connected to the internal electrodes, wherein the thickness of the lower dummy layer is smaller than the thickness of the upper dummy layer.
摘要:
Disclosed herein is a multilayered chip capacitor array, including a capacitor body having a plurality of dielectric layers, a plurality of pairs of first and second inner electrodes which are formed on the plurality of dielectric layers such that one electrode of one pair of inner electrodes faces the other electrode of the one pair of inner electrodes with one of the plurality of dielectric layers interposed therebetween, at least one first outer terminal and a plurality of second outer terminals formed on at least one surface of a top surface and a bottom surface of the capacitor body, and at least one first conductive via and a plurality of second conductive vias formed in a stacking direction of the capacitor body and connected to the first outer terminal and the second outer terminal, respectively.
摘要:
A multilayer chip capacitor includes a capacitor body having dielectric layers, and internal electrode layers separated from each other in the capacitor body by the dielectric layers. Each internal electrode layer has one or two leads and includes at least one coplanar electrode plate. External electrodes are electrically connected to the internal electrode layers via the leads. The internal electrode layers constitute a plurality of blocks stacked repeatedly. Each block includes a plurality of the internal electrode layers stacked successively. The leads extending to a face of the capacitor body are arranged in a zigzag shape along a stacking direction. The leads of vertically adjacent ones of the electrode plates having opposite polarities are arranged to be horizontally adjacent to each other.
摘要:
The present invention relates to a method of manufacturing a built-in type upper/lower electrode multi-layer part including alternately laminating a first ceramic sheet having a first internal electrode pattern formed thereon and a second ceramic sheet having a second internal electrode pattern formed thereon so as to form a first multi-layer sheet product; forming first and second via holes on the first multi-layer sheet product, the first and second via holes respectively connecting the first and second internal electrode patterns; respectively joining third and fourth ceramic sheets having no internal electrode pattern on the upper and lower portions of the first multi-layer sheet product so as to form a second multi-layer sheet product, the third and fourth ceramic sheets having third and fourth via holes formed to correspond to the first and second via holes; and filling a conductive paste in the first to fourth via holes.
摘要:
A 500 Mbps transmission apparatus is provided. The apparatus uses a 2P line which is capable of providing a 500 megabits-per-second service via a 2P UTP cable by adding a sub-layer which serializes and de-serializes symbols which have rates matched with each other and are synchronized, while maintaining a 1000BASE-T unique hierarchical architecture.
摘要:
A device for adjusting the inclination of the armrest by combined operation of the gear and cam mechanisms is provided. The device comprises a housing a ratchet member (12), a check member, a pivot control device comprising a fixed cam (22), a rotational com (24) and a torsion coil spring (32).
摘要:
A method for requesting a grant for Medium Access Control (MAC) being applied to a Passive Optical Network (PON) system. The method includes the steps of: a) deciding a period of a mini slot (Tms), which is necessary for a plurality of Optical Network Units (ONU) to transmit upstream cells to an Optical Line Termination (OLT); b) deciding a period of a divided slot (Tds) and a link overhead (Co) based on the period of the mini slot (Tms); c) calculating a length of the mini slot based on information to be transmitted to the OLT and a protocol being used; and d) requesting a grant for a MAC protocol between the plurality of the ONUs by calculating and allocating optimal parameters based on the length of the mini slot.
摘要:
A device for stooping car headrests is provided. The device includes a housing in which a stay of a car headrest is pivotably coupled thereto, a main spring installed in the housing to bias the stay and the headrest in the forward direction, an arresting member pivotably and resiliently fixed to the housing for releasably holding the stay and a check member having a release and pivotably and resiliently coupled to the arresting member for controlling movement of the arresting member.
摘要:
A 500 Mbps transmission apparatus is provided. The apparatus uses a 2P line which is capable of providing a 500 megabits-per-second service via a 2P UTP cable by adding a sub-layer which serializes and de-serializes symbols which have rates matched with each other and are synchronized, while maintaining a 1000BASE-T unique hierarchical architecture.