公开(公告)号：US08410585B2

公开(公告)日：2013-04-02

申请号：US11372597

申请日：2006-03-10

申请人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

发明人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

摘要翻译： 公开了使用引线框制造的金属引线框，半导体封装以及制造引线框和封装的方法。 在一个实施例中，引线框架包括矩形框架。 芯片焊盘和多个引线在框架内。 芯片焊盘的下侧和引线包括一个或多个垂直凹入的水平表面。 芯片焊盘的上侧可以包括围绕芯片安装区域的凹槽。 在封装中，芯片焊盘支撑与引线电连接的半导体芯片。 芯片焊盘的下侧和引线在封装体的外表面露出。 封装材料底部填充芯片焊盘和引线的凹陷的下表面，从而将它们锁定到密封材料上。 电线可以可靠地结合到在其上侧形成的槽内的芯片焊盘。

公开(公告)号：US07042068B2

公开(公告)日：2006-05-09

申请号：US09845601

申请日：2001-04-27

申请人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

发明人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.