公开(公告)号：US07042068B2

公开(公告)日：2006-05-09

申请号：US09845601

申请日：2001-04-27

申请人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

发明人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

公开(公告)号：US08410585B2

公开(公告)日：2013-04-02

申请号：US11372597

申请日：2006-03-10

申请人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

发明人： Byung Hoon Ahn ,  Jae Hun Ku ,  Young Suk Chung ,  Suk Gu Ko ,  Sung Sik Jang ,  Young Nam Choi ,  Won Chul Do

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

摘要翻译： 公开了使用引线框制造的金属引线框，半导体封装以及制造引线框和封装的方法。 在一个实施例中，引线框架包括矩形框架。 芯片焊盘和多个引线在框架内。 芯片焊盘的下侧和引线包括一个或多个垂直凹入的水平表面。 芯片焊盘的上侧可以包括围绕芯片安装区域的凹槽。 在封装中，芯片焊盘支撑与引线电连接的半导体芯片。 芯片焊盘的下侧和引线在封装体的外表面露出。 封装材料底部填充芯片焊盘和引线的凹陷的下表面，从而将它们锁定到密封材料上。 电线可以可靠地结合到在其上侧形成的槽内的芯片焊盘。

公开(公告)号：US06555899B1

公开(公告)日：2003-04-29

申请号：US09687541

申请日：2000-10-13

申请人： Young Suk Chung ,  Sung Sik Jang ,  Jae Hak Yee

发明人： Young Suk Chung ,  Sung Sik Jang ,  Jae Hak Yee

IPC分类号： H01L23495

CPC分类号： H01L23/49544 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package and the leadframe therefor having a reverse-down set part formed in the tie bar supporting the chip paddle. The reverse-down set part of the tie bar may be formed by a mechanical stamping process in such a way that it is present within the insulating body, interlocking therewith. This feature also facilitates the prevention of a short circuit between the tie bar that is exposed externally from the package body and the exposed internal lead through solder upon the mounting of a semiconductor package onto a motherboard.

摘要翻译： 一种半导体封装件及其引线框架，其具有形成在支撑芯片板的连接杆中的反向下降设定部件。 连杆的倒档固定部分可以通过机械冲压工艺形成，使其与绝缘体内部相互锁定。 该特征还有助于防止在将半导体封装安装在母板上时从封装主体外部露出的连接杆与通过焊料暴露的内部引线之间的短路。

公开(公告)号：US06525406B1

公开(公告)日：2003-02-25

申请号：US09687049

申请日：2000-10-13

申请人： Young Suk Chung ,  Sung Sik Jang ,  Jae Jin Lee ,  Tae Heon Lee ,  Hyung Ju Lee ,  Jung Woo Lee ,  Mu Hwan Seo ,  Jae Hak Yee ,  Ku Sun Hong

发明人： Young Suk Chung ,  Sung Sik Jang ,  Jae Jin Lee ,  Tae Heon Lee ,  Hyung Ju Lee ,  Jung Woo Lee ,  Mu Hwan Seo ,  Jae Hak Yee ,  Ku Sun Hong

IPC分类号： H01L23495

CPC分类号： H01L23/544 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to increase the moisture-permeation path of the finished package. A plurality of rectangular leads extends from the leadframe toward the die pad without contacting the die pad. A silver-plating layer may be formed on the upper surface of the leadframe. A semiconductor chip is mounted on the upper surface of the die pad in the leadframe. After deflashing, the package is treated with a sulfuric (H2SO4)-based solution to restore the internal leads to their original color. Prior to singulation, the externally exposed bottom surfaces of the leads are plated with copper, gold, solder, tin, nickel, palladium, or an alloy thereof to form a predetermined thickness of a plating layer. The singulation step comprises forming a burr at a peripheral side surface of the leads in the upward direction. The finished package may be marked with a recognition mark to enable a user to more easily identify the first lead.

摘要翻译： 公开了一种半导体封装及其制造方法。 平面或基本上平面的管芯焊盘设置在引线框架内，并且通过多个连接条连接到引线框架。 芯片焊盘的上表面和下表面的周边被半蚀刻以增加成品封装的透湿路径。 多个矩形引线从引线框架朝向管芯焊盘延伸，而不接触管芯焊盘。 可以在引线框架的上表面上形成镀银层。 半导体芯片安装在引线框架中的管芯焊盘的上表面上。 在消融后，将包装用硫酸（H 2 SO 4）的溶液处理，以将内部引线恢复到其原始颜色。 在分割之前，引线的外露的底表面镀有铜，金，焊料，锡，镍，钯或其合金，以形成预定厚度的镀层。 分割步骤包括在引线的周向侧表面沿向上方向形成毛刺。 完成的包装可以标记有识别标记，以使用户能够更容易地识别第一个引线。

公开(公告)号：US06867071B1

公开(公告)日：2005-03-15

申请号：US10194557

申请日：2002-07-12

申请人： Choon Heung Lee ,  Sung Sik Jang ,  Su Yol Yoo

发明人： Choon Heung Lee ,  Sung Sik Jang ,  Su Yol Yoo

IPC分类号： H01L21/44 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A leadframe comprising a frame body having four peripheral sides, each adjacent pair of which collectively defines a frame corner. Disposed within a central space or opening defined by the frame body is a die paddle including four peripheral edge segments, each adjacent pair of which collectively define a paddle corner. The leadframe also includes a plurality of tie bars, each of which comprises a first portion extending from a respective paddle corner of the die paddle and a second portion which extends angularly from the first portion and perpendicularly into connection with one of the sides of the frame body. Connected to and extending from the sides of the frame body toward and in spaced relation to respective ones of the peripheral edge segments of the die paddle are a plurality of leads. Additionally, connected to and extending from the sides of the frame body in close proximity to respective ones of the frame corners are a plurality of corner leads. Each of the corner leads extends in spaced, generally parallel relation to at least one of the peripheral edge segments of the die paddle.

摘要翻译： 一种引线框架，包括具有四个周边的框体，每个相邻的一对共同限定框架角。 设置在由框架体限定的中心空间或开口内的是包括四个周边边缘段的模片，每个相邻的一对共同限定了一个桨角。 引线框还包括多个连接杆，每个连接杆包括从模桨的相应桨角延伸的第一部分和从第一部分角度地延伸并且垂直地与框架的一个侧面连接的第二部分 身体。 连接到框架体的侧面并且与模具板的相应的周边边缘部分间隔开并且与间隔开的部分延伸的是多个引线。 另外，连接到框架主体的侧面并靠近相应的框架角部延伸的多个角部引线。 每个拐角引线以与模板的至少一个周边边缘部分间隔开的大致平行的关系延伸。

公开(公告)号：US07535085B2

公开(公告)日：2009-05-19

申请号：US11408521

申请日：2006-04-21

申请人： Sung Sik Jang

发明人： Sung Sik Jang

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.

摘要翻译： 一种半导体封装，其具有改进的芯片焊盘和封装主体之间的粘合性，并且改进了芯片焊盘的接合。 在芯片桨叶中形成多个通孔，以增加封装体中的封装材料的结合强度。 在芯片片中形成的多个突片也可单独使用或与通孔结合使用，以进一步增加封装体中封装材料的结合强度。 通过增加芯片桨的长度，这些翼片通过半导体芯片为接地线提供附加区域。

公开(公告)号：US07067908B2

公开(公告)日：2006-06-27

申请号：US10868643

申请日：2004-06-15

申请人： Sung Sik Jang

发明人： Sung Sik Jang

IPC分类号： H01L23/48 ,  H01L29/40 ,  H01L23/495 ,  H01L23/52

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.

公开(公告)号：US06853059B1

公开(公告)日：2005-02-08

申请号：US09687493

申请日：2000-10-13

申请人： Sung Sik Jang

发明人： Sung Sik Jang

IPC分类号： H01L23/04 ,  H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.

摘要翻译： 一种半导体封装，其具有改进的芯片焊盘和封装主体之间的粘合性，并且改进了芯片焊盘的接合。 在芯片桨叶中形成多个通孔，以增加封装体中的封装材料的结合强度。 在芯片片中形成的多个突片也可单独使用或与通孔结合使用，以进一步增加封装体中封装材料的结合强度。 通过增加芯片桨的长度，这些翼片通过半导体芯片为接地线提供附加区域。