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公开(公告)号：US20230203665A1
公开(公告)日：2023-06-29
申请号：US18147530
申请日：2022-12-28
Applicant: C. Uyemura & Co., Ltd.
Inventor： Yohei KANEKO , Katsuhisa Tanabe , Tsuyoshi Maeda , Naoshi Nishimura
IPC: C23C18/44
CPC classification number: C23C18/44
Abstract: A gold plating solution containing a gold cyanide salt, a reducing agent that is formaldehyde or its precursor, and an iron cyanide compound, and not containing a chelate compound having two or more iminodiacetic acid groups or aminomethylenephosphonic acid groups, is brought into contact with a chelating resin having an iminodiacetic acid group or an aminomethylenephosphonic acid group, thereby removing iron ions from the gold plating solution.
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Patent Agency Ranking
公开(公告)号：US20200340120A1
公开(公告)日：2020-10-29
申请号：US16844647
申请日：2020-04-09
Applicant: C. Uyemura & Co., Ltd.
Inventor： Tsuyoshi Maeda , Katsuhisa Tanabe , Naoshi Nishimura , Yohei Kaneko
Abstract: The purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else. In addition, the purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else, even when a film thickness of a gold plating film is thin. A gold plating method for wire bonding connection by plating using a silver catalyst on a copper or copper alloy film, comprising: a silver catalyst forming step for forming a silver film as the silver catalyst for forming a palladium film; a palladium film forming step for forming the palladium film on the silver catalyst; a gold plating film forming step for forming a gold plating film on the palladium film, wherein a film thickness of the silver film is 0.05 μm to 0.5 μm.
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公开(公告)号：US11814717B2
公开(公告)日：2023-11-14
申请号：US17219709
申请日：2021-03-31
Applicant: C. Uyemura & Co., Ltd.
Inventor： Yohei Kaneko , Yuhei Oogami , Katsuhisa Tanabe , Tsuyoshi Maeda
IPC: C23C18/44 , B32B15/01 , C25D3/50 , C08K3/11 , C08K5/09 , C08K5/17 , C08K5/36 , C08K5/372 , C08K3/30
CPC classification number: C23C18/44 , B32B15/018 , C08K3/11 , C08K5/09 , C08K5/17 , C08K5/36 , C08K5/372 , C25D3/50 , C08K2003/3009
Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.
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公开(公告)号：US11946144B2
公开(公告)日：2024-04-02
申请号：US16753395
申请日：2018-10-03
Applicant: C. Uyemura & Co., Ltd.
Inventor： Tsuyoshi Maeda , Katsuhisa Tanabe , Tomohiro Kawahara
Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.
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公开(公告)号：US20210310127A1
公开(公告)日：2021-10-07
申请号：US17219709
申请日：2021-03-31
Applicant: C. Uyemura & Co., Ltd.
Inventor： Yohei Kaneko , Yuhei Oogami , Katsuhisa Tanabe , Tsuyoshi Maeda
Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.
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公开(公告)号：US10975475B2
公开(公告)日：2021-04-13
申请号：US16806328
申请日：2020-03-02
Applicant: C. Uyemura & Co., Ltd.
Inventor： Yohei Kaneko , Naoshi Nishimura , Tsuyoshi Maeda , Katsuhisa Tanabe
IPC: C23C18/44
Abstract: The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.
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