公开(公告)号：US09687956B2

公开(公告)日：2017-06-27

申请号：US14440209

申请日：2013-11-05

申请人： Cabot Microelectronics Corporation

发明人： Ching-Ming Tsai ,  Shi-Wei Cheng ,  Kun-Shu Yang ,  Jia-Cheng Hsu ,  Sheng-Huan Liu ,  Feng-Chih Hsu ,  Craig Kokjohn

IPC分类号： B24B37/16 ,  B24B37/26 ,  B24B37/04

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/16

摘要： The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.

公开(公告)号：US09409276B2

公开(公告)日：2016-08-09

申请号：US14515560

申请日：2014-10-16

申请人： Cabot Microelectronics Corporation

发明人： Ching-Ming Tsai ,  Shi-Wei Cheng ,  Jia-Cheng Hsu ,  Kun-Shu Yang ,  Hui-Feng Chen ,  Gregory Gaudet ,  Sheng-Huan Liu

IPC分类号： B24B37/26

CPC分类号： B24B37/26

摘要： The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.

摘要翻译： 本发明提供一种抛光垫和使用抛光垫对基材进行化学机械研磨的方法。 抛光垫至少包括一个沟槽区域和一个排除区域，其中排除区域与抛光垫的圆周相邻，并且其中排除区域没有凹槽。

公开(公告)号：US20150298287A1

公开(公告)日：2015-10-22

申请号：US14440209

申请日：2013-11-05

申请人： CABOT MICROELECTRONICS CORPORATION

发明人： Ching-Ming Tsai ,  Shi-Wei Cheng ,  Kun-Shu Yang ,  Jia-Cheng Hsu ,  Sheng-Huan Liu ,  Feng-Chih Hsu ,  Craig Kokjohn

IPC分类号： B24B37/26 ,  B24B37/04

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/16

摘要： The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.

摘要翻译： 本发明提供一种抛光垫和使用抛光垫对基材进行化学机械研磨的方法。 抛光垫包括由至少第一多个具有第一同心度中心的同心凹槽组成的多个凹槽和具有第二同心度中心的第二多个同心凹槽。 同心度的第一中心与第二同心度中心不一致，抛光垫的旋转轴线与第一同心度中心和第二同心心中的至少一个不一致，多个凹槽不包括 的连续螺旋槽，并且抛光表面不包括镶嵌凹槽图案。