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公开(公告)号：US20130105298A1
公开(公告)日：2013-05-02
申请号：US13710696
申请日：2012-12-11
Applicant: Canon Anelva Corporation
Inventor： Koji TSUNEKAWA , Masahiro SUENAGA , Takeo KONNO
IPC: C23C14/54
CPC classification number: H01J37/3476 , C23C14/3464 , C23C14/505 , C23C14/54 , C23C14/542 , G11B5/3906 , G11B5/3909 , H01J37/32733 , H01J37/34 , H01J37/3429 , H01J37/3435 , H01J37/3473 , H01J2237/20214 , H01J2237/24578 , H01J2237/332
Abstract: A sputtering apparatus according to one embodiment of the present invention includes a substrate holder, a cathode unit arranged at a position diagonally opposite to the substrate holder, a position sensor for detecting a rotational position of the substrate, and a holder rotation controller for adjusting a rotation speed of the substrate according to the detected rotational position. The holder rotation controller controls the rotation speed so that the rotation speed of the substrate when the cathode unit is located on a side in a first direction as an extending direction of a process target surface of the relief structure is lower than the rotation speed of the substrate when the cathode unit is located on a side in a second direction which is perpendicular to the first direction along the rotation of the substrate.
Abstract translation: 根据本发明的一个实施例的溅射装置包括：衬底保持器，布置在与衬底保持器对角相对的位置处的阴极单元，用于检测衬底的旋转位置的位置传感器，以及用于调整衬底保持器的保持器旋转控制器 根据检测到的旋转位置的基板的旋转速度。 保持器旋转控制器控制旋转速度，使得当阴极单元位于第一方向的一侧时的基板的旋转速度作为浮雕结构的处理目标表面的延伸方向低于旋转速度 衬底，当阴极单元位于沿着衬底的旋转垂直于第一方向的第二方向的一侧上时。
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公开(公告)号：US20180254172A1
公开(公告)日：2018-09-06
申请号：US15971479
申请日：2018-05-04
Applicant: CANON ANELVA CORPORATION
Inventor： Koji TSUNEKAWA , Masahiro SUENAGA , Takeo KONNO
CPC classification number: H01J37/3476 , C23C14/3464 , C23C14/505 , C23C14/54 , C23C14/542 , G11B5/3906 , G11B5/3909 , H01J37/32733 , H01J37/34 , H01J37/3429 , H01J37/3435 , H01J37/3473 , H01J2237/20214 , H01J2237/24578 , H01J2237/332
Abstract: A sputtering apparatus according to one embodiment of the present invention includes a substrate holder, a cathode unit arranged at a position diagonally opposite to the substrate holder, a position sensor for detecting a rotational position of the substrate, and a holder rotation controller for adjusting a rotation speed of the substrate according to the detected rotational position. The holder rotation controller controls the rotation speed so that the rotation speed of the substrate when the cathode unit is located on a side in a first direction as an extending direction of a process target surface of the relief structure is lower than the rotation speed of the substrate when the cathode unit is located on a side in a second direction which is perpendicular to the first direction along the rotation of the substrate.
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公开(公告)号：US20160079045A1
公开(公告)日：2016-03-17
申请号：US14948481
申请日：2015-11-23
Applicant: CANON ANELVA CORPORATION
Inventor： Koji TSUNEKAWA , Masahiro SUENAGA , Takeo KONNO
CPC classification number: H01J37/3476 , C23C14/3464 , C23C14/505 , C23C14/54 , C23C14/542 , G11B5/3906 , G11B5/3909 , H01J37/32733 , H01J37/34 , H01J37/3429 , H01J37/3435 , H01J37/3473 , H01J2237/20214 , H01J2237/24578 , H01J2237/332
Abstract: A sputtering apparatus according to one embodiment of the present invention includes a substrate holder, a cathode unit arranged at a position diagonally opposite to the substrate holder, a position sensor for detecting a rotational position of the substrate, and a holder rotation controller for adjusting a rotation speed of the substrate according to the detected rotational position. The holder rotation controller controls the rotation speed so that the rotation speed of the substrate when the cathode unit is located on a side in a first direction as an extending direction of a process target surface of the relief structure is lower than the rotation speed of the substrate when the cathode unit is located on a side in a second direction which is perpendicular to the first direction along the rotation of the substrate.
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