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公开(公告)号：US20130343024A1
公开(公告)日：2013-12-26
申请号：US13916443
申请日：2013-06-12
发明人： Sou Hoshi , Nobuaki Yamashita , Yusuke Murai , Tohru Ohsaka
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H05K1/0228 , H05K1/0262 , H05K2201/09309 , H05K2201/10689 , Y02P70/611 , H01L2924/00012
摘要： On a surface layer of a printed wiring board, main power supply patterns to be applied with different DC voltages are disposed in a second region. Power supply patterns are disposed on the surface layer, and the power supply patterns are led from the main power supply patterns to a first region. The power supply patterns connect power supply terminals of terminal groups in the second region. The power supply patterns connect the power supply terminals between the terminal groups in the first region. Power supply terminals of the terminal groups of a semiconductor package are electrically connected to the main power supply patterns by the power supply patterns. Thus, potential fluctuations are reduced and radiation noise is suppressed, and the number of layers of the printed wiring board is reduced.
摘要翻译： 在印刷电路板的表面层上，施加有不同直流电压的主电源图案设置在第二区域中。 电源图案设置在表面层上，并且电源图案从主电源图案被引导到第一区域。 电源模式连接第二区域的端子组的电源端子。 电源模式将第一区域中的端子组之间的电源端子连接起来。 半导体封装的端子组的电源端子通过电源图案电连接到主电源图案。 因此，电位波动减小，辐射噪声被抑制，并且印刷电路板的层数减少。
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公开(公告)号：US09084364B2
公开(公告)日：2015-07-14
申请号：US13916443
申请日：2013-06-12
发明人： Sou Hoshi , Nobuaki Yamashita , Yusuke Murai , Tohru Ohsaka
CPC分类号： H05K1/181 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H05K1/0228 , H05K1/0262 , H05K2201/09309 , H05K2201/10689 , Y02P70/611 , H01L2924/00012
摘要： On a surface layer of a printed wiring board, main power supply patterns to be applied with different DC voltages are disposed in a second region. Power supply patterns are disposed on the surface layer, and the power supply patterns are led from the main power supply patterns to a first region. The power supply patterns connect power supply terminals of terminal groups in the second region. The power supply patterns connect the power supply terminals between the terminal groups in the first region. Power supply terminals of the terminal groups of a semiconductor package are electrically connected to the main power supply patterns by the power supply patterns. Thus, potential fluctuations are reduced and radiation noise is suppressed, and the number of layers of the printed wiring board is reduced.
摘要翻译： 在印刷电路板的表面层上，施加有不同直流电压的主电源图案设置在第二区域中。 电源图案设置在表面层上，并且电源图案从主电源图案被引导到第一区域。 电源模式连接第二区域的端子组的电源端子。 电源模式将第一区域中的端子组之间的电源端子连接起来。 半导体封装的端子组的电源端子通过电源图案电连接到主电源图案。 因此，电位波动减小，辐射噪声被抑制，并且印刷电路板的层数减少。
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