公开(公告)号：US12027373B2

公开(公告)日：2024-07-02

申请号：US17334075

申请日：2021-05-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Steven C. Shackleton ,  Seth J. Bamesberger ,  Xiaoming Lu ,  Byung-Jin Choi

IPC: H01L21/3105 ,  B05D3/06 ,  H01L21/67

CPC classification number: H01L21/31051 ,  B05D3/067 ,  H01L21/6715

Abstract: A method of planarizing a substrate comprises dispensing formable material onto a substrate, contacting a superstrate held by a superstrate chuck with the formable material on the substrate, thereby forming a multilayer structure including the superstrate, a film of the formable material, and the substrate, releasing the multilayer structure from the superstrate chuck, providing a space between the superstrate chuck and the multilayer structure after the releasing, positioning a light source into the provided space between the superstrate chuck and the multilayer structure, and curing the film of the multilayer structure by exposing the film to light emitted from the light source.

公开(公告)号：US20220384205A1

公开(公告)日：2022-12-01

申请号：US17334075

申请日：2021-05-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Steven C. Shackleton ,  Seth J. Bamesberger ,  Xiaoming Lu ,  Byung-Jin Choi

IPC: H01L21/3105

Abstract: A method of planarizing a substrate comprises dispensing formable material onto a substrate, contacting a superstrate held by a superstrate chuck with the formable material on the substrate, thereby forming a multilayer structure including the superstrate, a film of the formable material, and the substrate, releasing the multilayer structure from the superstrate chuck, providing a space between the superstrate chuck and the multilayer structure after the releasing, positioning a light source into the provided space between the superstrate chuck and the multilayer structure, and curing the film of the multilayer structure by exposing the film to light emitted from the light source.

公开(公告)号：US20220189832A1

公开(公告)日：2022-06-16

申请号：US17122910

申请日：2020-12-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Xiaoming Lu

IPC: H01L21/66 ,  H01L21/56 ,  H01L21/67

Abstract: A method of real time leveling control between a superstrate and a substrate is provided. A contact force model indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality peripheral axes is identified. A set point force required for performing the planarization is determined. Each force component is calculated based on the contact force model. The planarization is performed by applying each force component along a corresponding axis of the plurality of axes. The contact force model is identified based on a parallel condition between two contacting surfaces of a superstrate chuck for retaining the superstrate and a stack of the superstrate, the substrate, and formable material between the superstrate and the substrate.

公开(公告)号：US10248018B2

公开(公告)日：2019-04-02

申请号：US14673141

申请日：2015-03-30

Applicant: CANON KABUSHIKI KAISHA

Inventor： Philip D. Schumaker ,  Xiaoming Lu ,  Wei Zhang ,  Atsushi Kimura ,  Jun Ota

IPC: G03F7/00

Abstract: The present invention provides an imprint apparatus which molds an imprint material on a shot region formed on a substrate by using a mold including a pattern surface on which a pattern is formed, comprising a holding unit configured to change a position and orientation of the mold, and a control unit configured to cause the holding unit to incline the mold, and bring the mold and the imprint material into contact with each other while the mold is inclined, wherein after the control unit obtains a shift amount by which a mark on the mold shifts by inclining the mold, and changes relative positions of the mold and the substrate according to the shift amount, the control unit brings the mold and the imprint material into contact with each other.

公开(公告)号：US11823963B2

公开(公告)日：2023-11-21

申请号：US17122910

申请日：2020-12-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Xiaoming Lu

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/56

CPC classification number: H01L22/20 ,  H01L21/565 ,  H01L21/67126 ,  H01L21/67253

Abstract: A method of real time leveling control between a superstrate and a substrate is provided. A contact force model indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality peripheral axes is identified. A set point force required for performing the planarization is determined. Each force component is calculated based on the contact force model. The planarization is performed by applying each force component along a corresponding axis of the plurality of axes. The contact force model is identified based on a parallel condition between two contacting surfaces of a superstrate chuck for retaining the superstrate and a stack of the superstrate, the substrate, and formable material between the superstrate and the substrate.

公开(公告)号：US11614693B2

公开(公告)日：2023-03-28

申请号：US17364473

申请日：2021-06-30

Applicant: CANON KABUSHIKI KAISHA

Inventor： Xiaoming Lu ,  Logan L. Simpson ,  Mario Johannes Meissl

IPC: G03F7/20

Abstract: A system and method for shaping a film on a partial field including determining an initial contact point. Receiving information about: a partial field of a substrate; and an edge of a patternable area of the substrate. Determining a chord that connects intersection vertices of the partial field and the edge. Determining coordinates of a bisecting line, wherein the bisecting line bisects the chord, and the bisecting line is orthogonal to the chord. Determining an initial contact point range on the bisecting line in which a template and formable material on the substrate contact each other. Contacting the formable material in the partial field on the substrate with the template at an initial contact point within the initial contact point range.

公开(公告)号：US20230014261A1

公开(公告)日：2023-01-19

申请号：US17364473

申请日：2021-06-30

Applicant: CANON KABUSHIKI KAISHA

Inventor： Xiaoming Lu ,  Logan L. Simpson ,  Mario Johannes Meissl

IPC: G03F7/20

Abstract: A system and method for shaping a film on a partial field including determining an initial contact point. Receiving information about: a partial field of a substrate; and an edge of a patternable area of the substrate. Determining a chord that connects intersection vertices of the partial field and the edge. Determining coordinates of a bisecting line, wherein the bisecting line bisects the chord, and the bisecting line is orthogonal to the chord. Determining an initial contact point range on the bisecting line in which a template and formable material on the substrate contact each other. Contacting the formable material in the partial field on the substrate with the template at an initial contact point within the initial contact point range.

公开(公告)号：US20240178042A1

公开(公告)日：2024-05-30

申请号：US18059291

申请日：2022-11-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Xiaoming Lu ,  Jeffrey Dean Klein

IPC: H01L21/683 ,  G01N21/95 ,  G03F7/20 ,  H01L21/68

CPC classification number: H01L21/6838 ,  G01N21/9503 ,  G03F7/707 ,  H01L21/681

Abstract: Some devices, systems, and methods hold a periphery of a back surface of a plate with a flexible ring portion of a chuck assembly; apply a negative vacuum pressure to a central portion of the back surface of the plate to bow the central portion of the plate such that the back surface of the plate forms a convex surface and a front surface of the plate forms a concave surface; measure, at or near the periphery of the plate, distances between the plate and a reference location; and identify a location of a transition point of a tapered edge of the plate based on the measured distances.

公开(公告)号：US11587795B2

公开(公告)日：2023-02-21

申请号：US17035212

申请日：2020-09-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Xiaoming Lu

IPC: H01L21/67 ,  H01L21/3105 ,  H01L21/02

Abstract: A planarization apparatus, including a chuck having a first surface and a second surface at two opposing sides thereof. The chuck includes a first zone extending along a periphery of the chuck, a second zone at an inner portion of the chuck, the second zone being surrounded by the first zone; and a flexure connecting the first zone with the second zone. The first zone includes a first member extending along the first surface from the flexure and a first ring land protruding from the first member adjacent to the flexure.

公开(公告)号：US20220102156A1

公开(公告)日：2022-03-31

申请号：US17035212

申请日：2020-09-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Xiaoming Lu

IPC: H01L21/3105 ,  H01L21/02 ,  H01L21/67

Abstract: A planarization apparatus, including a chuck having a first surface and a second surface at two opposing sides thereof. The chuck includes a first zone extending along a periphery of the chuck, a second zone at an inner portion of the chuck, the second zone being surrounded by the first zone; and a flexure connecting the first zone with the second zone. The first zone includes a first member extending along the first surface from the flexure and a first ring land protruding from the first member adjacent to the flexure.