公开(公告)号：US09632108B2

公开(公告)日：2017-04-25

申请号：US14243640

申请日：2014-04-02

Applicant: CASCADE MICROTECH, INC.

Inventor： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R1/0408 ,  G01R31/2855 ,  G01R31/2874 ,  G01R31/2875 ,  G01R31/2886

Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.

公开(公告)号：US20140239991A1

公开(公告)日：2014-08-28

申请号：US14243640

申请日：2014-04-02

Applicant: CASCADE MICROTECH, INC.

Inventor： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

IPC: G01R1/04

CPC classification number: G01R1/0408 ,  G01R31/2855 ,  G01R31/2874 ,  G01R31/2875 ,  G01R31/2886

Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.

Abstract translation: 一种用于在确定的热条件下在探测器中验证或测试测试基板，即晶片和其它电子半导体部件的方法和装置。 这种本领域技术人员已知的探测器的验证装置具有壳体，该壳体具有至少两个壳体部分，在其一个壳体部分中，下文称为测试室，待验证的测试基板由 卡盘并设定在限定的温度，并且在其另一个壳体部分中，下文称为探针室，探针被保持。 为了验证目的，测试基板和探针通过至少一个定位装置相对于彼此定位，并且探头随后与测试基板接触。