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公开(公告)号：US09632108B2
公开(公告)日：2017-04-25
申请号：US14243640
申请日：2014-04-02
CPC分类号： G01R1/0408 , G01R31/2855 , G01R31/2874 , G01R31/2875 , G01R31/2886
摘要： A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
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公开(公告)号：US09395411B2
公开(公告)日：2016-07-19
申请号：US13953545
申请日：2013-07-29
发明人： Joerg Kiesewetter , Stojan Kanev , Michael Teich , Karsten Stoll , Axel Schmidt
CPC分类号： G01R31/2891 , G01R31/2874
摘要： In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.
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公开(公告)号：US20180031608A1
公开(公告)日：2018-02-01
申请号：US15725650
申请日：2017-10-05
CPC分类号： G01R1/18 , G01N27/42 , G01N31/02 , G01R1/06711 , G01R1/07378 , G01R1/07392 , G01R1/44
摘要： Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.
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公开(公告)号：US20170292974A1
公开(公告)日：2017-10-12
申请号：US15094716
申请日：2016-04-08
CPC分类号： G01R1/18 , G01N27/42 , G01N31/02 , G01R1/06711 , G01R1/07378 , G01R1/07392 , G01R1/44
摘要： Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.
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公开(公告)号：US10281492B2
公开(公告)日：2019-05-07
申请号：US15725650
申请日：2017-10-05
摘要： Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.
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公开(公告)号：US09784763B1
公开(公告)日：2017-10-10
申请号：US15094716
申请日：2016-04-08
CPC分类号： G01R1/18 , G01N27/42 , G01N31/02 , G01R1/06711 , G01R1/07378 , G01R1/07392 , G01R1/44
摘要： Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.
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公开(公告)号：US20170248973A1
公开(公告)日：2017-08-31
申请号：US15056803
申请日：2016-02-29
发明人： Michael Teich , Jörg Kiesewetter , Ulf Hackius , Frank Zill , Mirko Kreher
IPC分类号： G05D7/06 , H01L21/687 , G01R31/26 , H01L21/66 , G01R31/00 , G05B19/418 , H01L21/67
CPC分类号： G01R31/2642 , G01R31/2862 , G01R31/2881 , G05B19/41805 , G05B2219/45031 , G05D22/02 , H01L21/67248 , H01L22/26
摘要： Probe systems and methods including active environmental control are disclosed herein. The methods include placing a substrate, which includes a device under test (DUT), on a support surface of a chuck. The support surface extends within a measurement environment that is at least partially surrounded by a measurement chamber. The methods further include determining a variable associated with a moisture content of the measurement environment and receiving a temperature associated with the measurement environment. The methods also include supplying a purge gas stream to the measurement chamber at a purge gas flow rate and selectively varying the purge gas flow rate such that a dew point temperature of the measurement environment is within a target dew point temperature range. The methods further include providing a test signal to the DUT and receiving a resultant signal from the DUT. The systems include probe systems that perform the methods.
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8.发明申请METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONS 有权用于在定义的热条件下在探测器中验证测试基板的方法公开(公告)号：US20140239991A1
公开(公告)日：2014-08-28
申请号：US14243640
申请日：2014-04-02
IPC分类号： G01R1/04
CPC分类号： G01R1/0408 , G01R31/2855 , G01R31/2874 , G01R31/2875 , G01R31/2886
摘要： A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
摘要翻译： 一种用于在确定的热条件下在探测器中验证或测试测试基板，即晶片和其它电子半导体部件的方法和装置。 这种本领域技术人员已知的探测器的验证装置具有壳体，该壳体具有至少两个壳体部分，在其一个壳体部分中，下文称为测试室，待验证的测试基板由 卡盘并设定在限定的温度，并且在其另一个壳体部分中，下文称为探针室，探针被保持。 为了验证目的，测试基板和探针通过至少一个定位装置相对于彼此定位，并且探头随后与测试基板接触。
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9.发明申请METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER 有权在定义的热条件和热调节探头下测试测试基板的方法公开(公告)号：US20140028337A1
公开(公告)日：2014-01-30
申请号：US13953545
申请日：2013-07-29
发明人： Joerg Kiesewetter , Stojan Kanev , Michael Teich , Karsten Stoll , Axel Schmidt
IPC分类号： G01R31/28
CPC分类号： G01R31/2891 , G01R31/2874
摘要： In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.
摘要翻译： 在用于在限定的热条件下测试测试基板的方法和装置中，待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度，并且该温度保持恒定。
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