公开(公告)号：US20110278055A1

公开(公告)日：2011-11-17

申请号：US12908217

申请日：2010-10-20

Applicant: CHENG-FENG CHIANG

Inventor： CHENG-FENG CHIANG

IPC: H05K1/11 ,  B05D5/12

CPC classification number: H05K1/11 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/09118 ,  H05K2203/1476 ,  H05K2203/175 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: In a method of manufacturing a three-dimensional (3D) circuit device, conducting circuits are formed on a non-conductive base through electroplating. The non-conductive base, and a circuit pattern section, at least one conducting junction and at least one current-guiding junction provided on the base are formed through double injection molding process. An electrically conductive interface layer is formed on the circuit pattern section and the junctions; and then, metal circuits are formed on the circuit pattern section through electroplating. By providing the conducting junction and the current-guiding junction, when forming metal circuits through electroplating, electroplating current can be evenly distributed over the circuit pattern section to form metal coating with uniform thickness, which enables upgraded production efficiency and reduced cost in manufacturing a 3D circuit device.

Abstract translation: 在制造三维（3D）电路器件的方法中，通过电镀在非导电基底上形成导电电路。 通过双注射成型工艺形成非导电基底和电路图形部分，至少一个导电结和设置在基底上的至少一个电流引导结。 在电路图形部分和接点上形成导电界面层; 然后通过电镀在电路图形部分上形成金属电路。 通过提供导电结和导流结，当通过电镀形成金属电路时，电镀电流可以均匀地分布在电路图形部分上，以形成均匀厚度的金属涂层，从而提高生产效率并降低制造3D的成本 电路设备。