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    ILLUMINATION DEVICE AND CAR WITH SAME
    2.
    发明申请
    ILLUMINATION DEVICE AND CAR WITH SAME 审中-公开
    照明装置和汽车

    公开(公告)号：US20090168441A1

    公开(公告)日：2009-07-02

    申请号：US12110564

    申请日：2008-04-28

    申请人： MEI-JIUN LIN ,  JUI-WEN FANG ,  HUNG-CHIH YANG ,  SHU-HUI HSIEH ,  CHIH-MING LAI

    发明人： MEI-JIUN LIN ,  JUI-WEN FANG ,  HUNG-CHIH YANG ,  SHU-HUI HSIEH ,  CHIH-MING LAI

    IPC分类号： B60Q1/00 ,  F21V7/00

    CPC分类号： G02B6/0081 ,  G02B6/0068 ,  G02B6/0073

    摘要： An illumination device includes a light emitting module (20) and a mounting housing (10) for receiving the light emitting module therein. The light emitting module includes a light guide plate (21) and a light source (23) optically coupled to the light guide plate. The mounting housing includes a top plate (12), a mounting plate (14) and a side plate (16) interconnected between the top plate and the mounting plate. A receiving space (15) is cooperatively formed by the top plate, the mounting plate and the side plate of the mounting housing for receiving the light guide plate therein. A gap (120) is defined in the top plate above the light emitting module. An opening (160) is defined in one end of the side plate for allowing the light emitting module to insert into the receiving space.

    摘要翻译： 照明装置包括用于在其中接收发光模块的发光模块（20）和安装壳体（10）。 发光模块包括光导板（21）和与光导板光耦合的光源（23）。 安装壳体包括互连在顶板和安装板之间的顶板（12），安装板（14）和侧板（16）。 接收空间（15）由顶板，安装板和安装壳体的侧板协同地形成，用于在其中容纳导光板。 在发光模块上方的顶板中限定间隙（120）。 开口（160）被限定在侧板的一端，用于允许发光模块插入接收空间。

    METHOD FOR PROCESSING BRITTLE SUBSTRATES WITHOUT MICRO-CRACKS
    3.
    发明申请
    METHOD FOR PROCESSING BRITTLE SUBSTRATES WITHOUT MICRO-CRACKS 审中-公开
    用于处理没有微裂纹的基片的方法

    公开(公告)号：US20080035617A1

    公开(公告)日：2008-02-14

    申请号：US11626037

    申请日：2007-01-23

    申请人： CHEN-TSU FU ,  CHUN-KAI HUANG ,  HSIEN-TANG CHEN ,  JUI-WEN FANG ,  FANG-SHIUAN KUO ,  TSUNG-FU HSU

    发明人： CHEN-TSU FU ,  CHUN-KAI HUANG ,  HSIEN-TANG CHEN ,  JUI-WEN FANG ,  FANG-SHIUAN KUO ,  TSUNG-FU HSU

    IPC分类号： B23K26/38 ,  B23K26/40

    CPC分类号： B23K26/0608 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/52 ,  B28D5/0011 ,  C03B33/093

    摘要： A method for processing a brittle substrate includes first providing a brittle substrate having a substrate surface. Then applying a first laser beam onto the brittle substrate surface to form a pre-cut groove in the brittle substrate, the first laser beam being generated by a solid-state laser device. A second laser beam is then applied onto the brittle substrate surface along the precut groove to heat the brittle substrate, the second laser beam being generated by a gas laser device. Finally, a coolant is applied onto the brittle substrate along the pre-cut groove so as to cause formation of a through crack in the brittle substrate. The first laser beam can be generated by a solid-state laser device, the first laser beam should be of narrow diameter and high energy density, so the first laser beam can form a pre-cut groove rapidly and accurately without generation of micro-cracks, in addition, the pre-cut groove should have a better uniformity and linearity.

    摘要翻译： 一种脆性基板的处理方法包括：首先提供具有基板表面的脆性基板。 然后将第一激光束施加到脆性基板表面上以在脆性基板中形成预切割凹槽，第一激光束由固态激光装置产生。 然后沿着预切槽将第二激光束施加到脆性衬底表面上以加热脆性衬底，第二激光束由气体激光器件产生。 最后，将冷却剂沿着预切割槽施加到脆性基底上，以便在脆性基底中形成通孔。 第一激光束可以由固态激光装置产生，第一激光束应具有窄直径和高能量密度，因此第一激光束可以快速而准确地形成预切割槽，而不产生微裂纹 另外，预切槽应具有更好的均匀性和线性。

    METHOD AND APPARATUS FOR LASER MACHINING
    4.
    发明申请
    METHOD AND APPARATUS FOR LASER MACHINING 审中-公开
    激光加工的方法和装置

    公开(公告)号：US20080053973A1

    公开(公告)日：2008-03-06

    申请号：US11757157

    申请日：2007-06-01

    申请人： CHEN-TSU FU ,  CHUN-KAI HUANG ,  HSIEN-TANG CHEN ,  JUI-WEN FANG ,  FANG-SHIUAN KUO ,  TSUNG-FU HSU

    发明人： CHEN-TSU FU ,  CHUN-KAI HUANG ,  HSIEN-TANG CHEN ,  JUI-WEN FANG ,  FANG-SHIUAN KUO ,  TSUNG-FU HSU

    IPC分类号： B23K26/38

    CPC分类号： B23K26/083 ,  B23K26/0869 ,  B23K26/40 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/091

    摘要： An exemplary method for laser machining is provided comprising: providing a workpiece, the workpiece including a predetermined machining region; loading the workpiece onto a laser machining station, the laser machining station being configured for providing an initial ambient temperature for the workpiece; heating the machining region of the workpiece up to a predetermined temperature between the initial ambient temperature and a melting temperature of a material of the workpiece; and machining the machining region with at least one laser beam. An exemplary apparatus for laser machining is also provided.

    摘要翻译： 提供了一种用于激光加工的示例性方法，包括：提供工件，所述工件包括预定的加工区域; 将所述工件装载到激光加工站上，所述激光加工台被配置为提供所述工件的初始环境温度; 将工件的加工区域加热到初始环境温度和工件材料的熔化温度之间的预定温度; 并用至少一个激光束加工加工区域。 还提供了用于激光加工的示例性装置。