公开(公告)号：US20130077251A1

公开(公告)日：2013-03-28

申请号：US13526604

申请日：2012-06-19

申请人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  BAO-QUAN SHI ,  JING-JUN NI

发明人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  BAO-QUAN SHI ,  JING-JUN NI

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F16B39/10 ,  G06F1/20 ,  H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.

摘要翻译： 散热器安装装置包括触摸板和安装构件。 触摸板限定了一个锁定孔。 安装构件包括锁定柱。 锁定柱包括主体和从主体突出的两个突起。 锁定孔的内表面限定了两个切口。 触摸板包括从触摸板的底表面上的锁定孔的边缘延伸的两个阻挡块。 两个突起从两个切口延伸并邻接触摸板的底表面。 两个突起中的一个位于两个阻挡块之间，以防止主体在锁定孔中自由旋转。

公开(公告)号：US20130155611A1

公开(公告)日：2013-06-20

申请号：US13571452

申请日：2012-08-10

申请人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  JING-JUN NI

发明人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  JING-JUN NI

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： G06F1/20 ,  G06F1/203

摘要： An electronic device includes a bottom plate, a cover plate, a dust collection box, and a dust cleaning apparatus. A heat sink is mounted in the bottom plate. The cover plate covers on the bottom plate. The cover plate defines a cutout. The dust collection box is placed on the bottom plate via the cutout. The dust cleaning apparatus is slidably mounted on the bottom plate. The dust cleaning apparatus moves relative to the heat sink to sweep dust of the heat sink into the dust collection box.

摘要翻译： 电子装置包括底板，盖板，集尘箱和除尘装置。 散热器安装在底板上。 盖板盖在底板上。 盖板限定了切口。 集尘箱通过切口放置在底板上。 除尘装置可滑动地安装在底板上。 除尘装置相对于散热器移动，将散热器的灰尘除尘到集尘箱中。

公开(公告)号：US20130070419A1

公开(公告)日：2013-03-21

申请号：US13483305

申请日：2012-05-30

申请人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  CHENG HAO ,  ER-WEI LU

发明人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  CHENG HAO ,  ER-WEI LU

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole.

摘要翻译： 电子设备包括电路板和散热模块。 电路板包括主体和位于主体上的第一发热部。 主体限定了靠近第一发热部分的通孔。 散热模块包括热管，附接到热管的第一散热片和弹性片。 弹性件包括固定到第一散热片和弹性臂的固定部分。 弹性臂接合在通孔中，以将第一散热片固定到身体上。 第一散热片邻接第一发热部分，弹性臂可弹性变形以与通孔脱离接触。

公开(公告)号：US20130155624A1

公开(公告)日：2013-06-20

申请号：US13456498

申请日：2012-04-26

申请人： CHIH-HAO YANG ,  BAO-QUAN SHI ,  RONG YANG ,  XIANG-KUN ZENG

发明人： CHIH-HAO YANG ,  BAO-QUAN SHI ,  RONG YANG ,  XIANG-KUN ZENG

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.

摘要翻译： 散热结构包括散热器，散热器具有形成有从基座的四个角横向延伸的四个固定突出部的基座。 四个定位柱从印刷电路板向上突出。 四个弹簧夹分别连接在四个定位柱上。 四个弹簧夹中的每一个具有弹性件，用于施加向下的力以按压相应的固定突片，从而将散热器固定到印刷电路板。

公开(公告)号：US20130161074A1

公开(公告)日：2013-06-27

申请号：US13596718

申请日：2012-08-28

申请人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  CHENG HAO ,  ER-WEI LU

发明人： CHIH-HAO YANG ,  XIANG-KUN ZENG ,  CHENG HAO ,  ER-WEI LU

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic device includes a circuit board and a heat sink . A heat generating part is located on the circuit board. Through holes are defined in the circuit board. The heat sink includes a main body and resilient pieces located on the main body. The resilient pieces includes a latching portion and a resisting portion located on the latching portion. The latching portion extends through the through hole to engage with the circuit board. The resisting portion is received in the through hole and abuts the circuit board. The main body closely abuts the heat generating part. The latching portion can be disengaged from the circuit board simply by squeezing the resisting portion.

摘要翻译： 电子设备包括电路板和散热器。 发热部位于电路板上。 电路板中定义了通孔。 散热器包括主体和位于主体上的弹性片。 弹性件包括锁定部分和位于闩锁部分上的阻挡部分。 闩锁部分延伸穿过通孔以与电路板接合。 阻力部分被容纳在通孔中并且邻接电路板。 主体紧贴发热部分。 简单地通过挤压阻挡部分，可以将闩锁部分与电路板脱离。

公开(公告)号：US20120188715A1

公开(公告)日：2012-07-26

申请号：US13323903

申请日：2011-12-13

申请人： XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

发明人： XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

IPC分类号： H05K7/20

CPC分类号： H05K5/0213 ,  G06F1/182 ,  G06F1/20

摘要： An enclosure of an electronic device includes a front panel including a plurality of first air guiding boards and a plurality of second air guiding boards. The plurality of first air guiding boards arrange a first air guiding layer, and the plurality of second air guiding boards arrange a second air guiding layer. A first gap is defined between adjacent two of the plurality of first air guiding boards, a second gap is defined between adjacent two of the plurality of second air guiding boards, and a third gap is defined between the first air guiding layer and the second air guiding layer. Each second air guiding board is located opposite to the first gap. An absorbing layer is placed on a side surface of each second air guiding board towards the first gap. The first gap communicates with the second gap and the third gap.

摘要翻译： 电子设备的外壳包括前面板，其包括多个第一空气引导板和多个第二引导板。 多个第一空气引导板布置有第一空气引导层，并且多个第二引导板布置第二空气引导层。 在所述多个第一空气引导板的相邻两个之间限定第一间隙，在所述多个第二空气引导板的相邻两个之间限定第二间隙，并且在所述第一空气引导层和所述第二空气引导板之间限定第三间隙 引导层。 每个第二引导板与第一间隙相对。 吸收层朝向第一间隙放置在每个第二引导板的侧表面上。 第一间隙与第二间隙和第三间隙连通。

公开(公告)号：US20100319886A1

公开(公告)日：2010-12-23

申请号：US12563227

申请日：2009-09-21

申请人： XIANG-KUN ZENG ,  ZHI-GUO ZHANG ,  LI-FU XU

发明人： XIANG-KUN ZENG ,  ZHI-GUO ZHANG ,  LI-FU XU

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： G06F1/20

摘要： A heat dissipating assembly includes a heat exchanger and an air duct. The heat exchanger includes a plurality of fins aligned in a row, and the fins cooperatively define a plurality of heat dissipating channels. A guiding slot is defined in the heat exchanger. The air duct defines a passage. A positioning hook extends from the air duct and engages in the guiding slot to so that the air duct passage and are aligned with the heat dissipating channels so that an air flow is capable of passing through the air duct passage via the heat dissipating channels.

摘要翻译： 散热组件包括热交换器和空气管道。 热交换器包括排列成一排的多个翅片，翅片协同地限定多个散热通道。 在热交换器中限定了引导槽。 风道限定通道。 定位钩从空气管道延伸并接合在引导槽中，使得空气管道通道与散热通道对准，使得气流能够经由散热通道穿过空气管道通道。

公开(公告)号：US20120241136A1

公开(公告)日：2012-09-27

申请号：US13301862

申请日：2011-11-22

申请人： XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

发明人： XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

IPC分类号： F28F13/00

CPC分类号： G06F1/20 ,  F28F3/025 ,  F28F3/048 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device for cooling an electronic component is disclosed. The cooling device comprises a cooler comprising a base, a plurality of first fins and a plurality of second fins. The plurality of first fins extends substantially perpendicular from the base, and the plurality of second fins are secured to the base. Each of the plurality of second fins is between adjacent two of the plurality of first fins. Each of the plurality of second fins comprises a plurality of body portions and a plurality of connecting pieces. Each of the plurality of connecting pieces connects adjacent two of the plurality of body portions.

摘要翻译： 公开了一种用于冷却电子部件的冷却装置。 冷却装置包括一个包括一个底座，多个第一散热片和多个第二散热片的冷却器。 所述多个第一散热片基本上垂直于所述基座延伸，并且所述多个第二散热片固定到所述基座。 多个第二散热片中的每一个在相邻的多个第一散热片之间。 多个第二翅片中的每一个包括多个主体部分和多个连接件。 多个连接片中的每一个连接多个主体部分中的相邻的两个。

公开(公告)号：US20120222841A1

公开(公告)日：2012-09-06

申请号：US13195004

申请日：2011-08-01

申请人： CHAO-JUN ZHU ,  XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

发明人： CHAO-JUN ZHU ,  XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

IPC分类号： F28F13/12

CPC分类号： G06F1/20

摘要： A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

摘要翻译： 散热系统包括外壳，第一散热器，第二散热器和风扇。 外壳包括底板，第一侧板和第二侧板。 第一排气区位于第一侧板上。 第二通气区域位于第二侧板上。 第一发热装置和第二发热装置安装在底板上并且位于第一通气区域和第二通气区域之间。 第一散热器安装在底板上并接触第一发热装置。 第二散热器安装在底板上并接触第二发热装置。 多个第二散热片位于第二散热器上。 每个第二个鳍都是波浪的。 风扇位于第一通气区域和第二通气区域之间。 风扇适于驱动空气流过第一通气区域，第一散热器，多个第二散热片和第二通气区域。

公开(公告)号：US20120181000A1

公开(公告)日：2012-07-19

申请号：US13193626

申请日：2011-07-29

申请人： CHAO-JUN ZHU ,  XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

发明人： CHAO-JUN ZHU ,  XIANG-KUN ZENG ,  ZHI-JIANG YAO ,  LI-FU XU

IPC分类号： F28F13/00

CPC分类号： G06F1/20 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink and a fan. The heat sink includes a plurality of fins. The plurality of fins is parallel with each other. Each of the plurality of fins includes two side faces. Each side face is waved. An air channel is located between two adjacent side faces of two adjacent fins. The air channel includes a plurality of wide portions and a plurality of narrow portions interlaced with the plurality of wide portions. The fan is located on a side of the air channel. The fan is adapted to drive air flowing fast in the plurality of narrow portions of the air channel and flowing slow in the plurality of wide portions of the air channel.

摘要翻译： 散热组件包括散热器和风扇。 散热片包括多个散热片。 多个翅片彼此平行。 多个翅片中的每一个包括两个侧面。 每一面都挥舞着。 空气通道位于两个相邻散热片的两个相邻的侧面之间。 空气通道包括与多个宽部分交织的多个宽部分和多个窄部分。 风扇位于空气通道的一侧。 风扇适于驱动在空气通道的多个狭窄部分中快速流动的空气并且在空气通道的多个宽部分中缓慢流动。