摘要:
A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.
摘要:
A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.
摘要:
A supporting apparatus for assembling a display, includes a supporting bracket. The supporting bracket includes a plate and a restricting arm connected to the plate. The restricting arm includes a connection portion and a restricting portion the restricting. The restricting portion is parallel to the plate to define a restricting space between the restricting portion and the plate. The restricting space receives the display therein. The restricting portion and the plate restricts the display in the restricting space in a first direction which is perpendicular to the plate. A plurality of blocks are movably mounted on the plate. The plurality of blocks restrict the display in the restrict space in a second direction which is parallel to the plate.
摘要:
An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole.
摘要:
An electronic device includes a circuit board and a heat sink . A heat generating part is located on the circuit board. Through holes are defined in the circuit board. The heat sink includes a main body and resilient pieces located on the main body. The resilient pieces includes a latching portion and a resisting portion located on the latching portion. The latching portion extends through the through hole to engage with the circuit board. The resisting portion is received in the through hole and abuts the circuit board. The main body closely abuts the heat generating part. The latching portion can be disengaged from the circuit board simply by squeezing the resisting portion.
摘要:
An electronic device includes a bottom plate, a cover plate, a dust collection box, and a dust cleaning apparatus. A heat sink is mounted in the bottom plate. The cover plate covers on the bottom plate. The cover plate defines a cutout. The dust collection box is placed on the bottom plate via the cutout. The dust cleaning apparatus is slidably mounted on the bottom plate. The dust cleaning apparatus moves relative to the heat sink to sweep dust of the heat sink into the dust collection box.
摘要:
A heat dissipating apparatus (100) includes a heat sink (20) and a plurality of fastening elements (10). The heat sink includes a base (22) and a plurality of fins (24). The fastening element includes a head (12), a resilient member (14) and a connecting member (16). The connecting member includes two blocks (166). The base of the heat sink defines a plurality of through holes (222b) therein for extension of the connecting members of the fastening elements, wherein two opposite cutouts (222c) are defined in the base and communicating with each of the through holes. After the connecting member and the two blocks are downward extended through the through hole and the cutouts, respectively, the connecting member is rotated a degree so that the blocks securely abut against a bottom surface of the base.
摘要:
A cooling system for removing heat from a heat generating component, includes a base (100) and a heat sink (200) mounted on the base. The base includes a bottom wall (20) and a side wall (10) surrounding the bottom wall. The bottom wall and the side wall cooperatively define a space (40) receiving working fluid therein. The heat sink defines an evaporating passage (220) and a condensing passage (230) therein. The two passages are in fluid communication with the space. Cooperatively the space and the passages define a loop for circulating the working fluid therein. The working fluid has a phase change for dissipating heat generated by a heat-generating electronic component.
摘要:
An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.
摘要:
A control circuit and method of a switching DC-DC power supply detects the error between the output voltage of the power supply and a design value of the output voltage and according to the error, determines an offset adjust signal to adjust the offset of an error comparator of the power supply to pull the output voltage toward the design value.