公开(公告)号：US11169178B2

公开(公告)日：2021-11-09

申请号：US17023445

申请日：2020-09-17

申请人： Chroma Ate Inc.

发明人： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Bo-An Su ,  Yu-Hsuen Wang

IPC分类号： G01R1/04

摘要： The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.

公开(公告)号：US10948518B2

公开(公告)日：2021-03-16

申请号：US16417833

申请日：2019-05-21

申请人： Chroma Ate Inc.

发明人： Chien-Ming Chen ,  Meng-Kung Lu ,  Yung-Chih Chen

IPC分类号： G01R1/04

摘要： A test apparatus for testing electronic device comprises a lower base, an upper base and a pressing force generating module disposed between the upper and lower bases. The lower base having a chip socket for receiving a plurality of probes, and a test socket plate having a first guiding device, each of the probes has a spring force stored therein. The upper base having a second guiding device coupled to the first guiding device. When an electronic device is placed in the chip socket, and the upper base is slidably moved with respect to the lower base by the cooperative actions between the first and second guiding devices, so that the pressing force generating module is in alignment with the electronic device for applying a pressing force on the electronic device, and the pressing force being greater than the sum of the spring forces generated by the plurality of probes.

公开(公告)号：US09678158B2

公开(公告)日：2017-06-13

申请号：US14644552

申请日：2015-03-11

申请人： CHROMA ATE INC.

发明人： Chien-Ming Chen

IPC分类号： G01R31/00 ,  G01R31/3185 ,  G01R31/28 ,  G01R1/04

CPC分类号： G01R31/318513 ,  G01R1/04 ,  G01R31/2863

摘要： An apparatus for testing a package-on-package semiconductor device includes a top cover, a lower base, a heat dissipation module, and a plurality of probes. The lower base is disposed under the top cover so as to form an internal accommodation space for receiving an upper chip. The heat dissipation module includes a heat sink arranged in the internal accommodation space and attached to an upper surface of the upper chip. The probes are arranged in the lower base so as to electrically connect the upper chip with a lower chip. By the heat sink arranged in the internal accommodation space formed of the top cover and the lower base, heat generated from the upper chip during operation of the upper chip can be greatly dissipated so that the performance and the service life of the upper chip can be improved.

公开(公告)号：US09347989B2

公开(公告)日：2016-05-24

申请号：US13875660

申请日：2013-05-02

申请人： CHROMA ATE INC.

发明人： Chien-Ming Chen ,  Meng-Kung Lu

IPC分类号： G01R31/00 ,  G01R31/28

CPC分类号： G01R31/2887 ,  G01R31/2896

摘要： A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.

摘要翻译： 提供了一种用于测试封装封装（PoP）堆叠芯片的底部芯片的测试设备。 底部芯片的上表面具有用于电连接PoP堆叠芯片的顶部芯片的多个对应焊接点的多个焊接点。 测试装置包括测试头和多个测试触点。 测试头内部安装了顶部芯片。 多个测试触点安装在测试头的下表面上并电连接到测试头内的顶部芯片的多个对应焊接点。 当测试头的下表面接触底部芯片的上表面时，多个测试触点电连接到多个焊接点以测试底部芯片。

公开(公告)号：US11630147B2

公开(公告)日：2023-04-18

申请号：US17551246

申请日：2021-12-15

申请人： CHROMA ATE INC.

发明人： Ming Cheng Huang ,  Tsung-I Lin ,  Hui-Jung Wu ,  Chien-Ming Chen

IPC分类号： G01R31/28 ,  G01R1/04

摘要： The present invention relates to a low-thermal resistance pressing device for a socket, which mainly comprises a housing, an inner collar, a heat conductive pressing block, a bearing collar and a locking member. The locking member on the housing is used to lock the socket. The inner collar is threadedly engaged with the housing. The bearing collar is located between the inner collar and the heat conductive pressing block. In the case of rotating the inner collar in the housing, the bearing collar drives the heat conductive pressing block to move axially so as to exert an axial force to a device to be tested. Because the heat conductive pressing block protrudes from the upper and lower surfaces of the housing, one end thereof can be in contact with a temperature control module, and the other end thereof can be in contact with the device to be tested.

公开(公告)号：US20200081060A1

公开(公告)日：2020-03-12

申请号：US16559701

申请日：2019-09-04

申请人： Chroma Ate Inc.

发明人： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Meng-Kung Lu

IPC分类号： G01R31/28 ,  G01R1/04

摘要： The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

公开(公告)号：US09638740B2

公开(公告)日：2017-05-02

申请号：US14048785

申请日：2013-10-08

申请人： CHROMA ATE INC.

发明人： Chien-Ming Chen ,  Herbert Tsai ,  Chin-Yi Ou Yang

IPC分类号： G01R31/26 ,  G01R31/28

CPC分类号： G01R31/2601 ,  G01R31/2887 ,  G01R31/2893

摘要： A test system with rotational test arms for testing semiconductor components includes a transport device, a first test socket, a second test socket, a first test arm, and a second test arm. The first test socket and the second test socket are electrically connected to different test signals respectively and correspond to the first test arm and the second test arm. The first test arm and the second test arm test arms operate rotationally to carry and place the semiconductor components to the transport device, the first test socket and the second test socket, so the test time is improved.

公开(公告)号：US09250292B2

公开(公告)日：2016-02-02

申请号：US13854372

申请日：2013-04-01

申请人： CHROMA ATE INC.

发明人： Chien-Ming Chen

IPC分类号： G01R31/28

CPC分类号： G01R31/2896 ,  G01R31/2887

摘要： A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.

摘要翻译： 公开了一种用于测试半导体封装堆叠芯片的测试系统。 该系统包括测试插座，测试臂和测试机构。 测试机构包括探针测试装置。 探针测试装置内部具有测试芯片，并且多个测试探针电连接到测试芯片。 多个测试探针延伸到测试插座，用于接触加载在测试插座上的芯片下测试。 当测试机构移动到测试插座和测试臂之间的上部位置时，测试臂沿垂直方向向下移动并按压测试机构，从而迫使测试机构中的多个测试探针紧紧靠在芯片上 - 测试，使测试机构内的测试芯片可以电连接到芯片下测试以形成测试回路。

公开(公告)号：US20230023844A1

公开(公告)日：2023-01-26

申请号：US17580705

申请日：2022-01-21

申请人： CHROMA ATE INC.

发明人： Chin-Yi Ouyang ,  Wei-Cheng Kuo ,  Chien-Ming Chen ,  Xin-Yi Wu

IPC分类号： G05B19/401 ,  G01B21/04

摘要： A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

公开(公告)号：US11333704B2

公开(公告)日：2022-05-17

申请号：US16559701

申请日：2019-09-04

申请人： Chroma Ate Inc.

发明人： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Meng-Kung Lu

IPC分类号： G01R31/28 ,  G01R1/04

摘要： The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.