公开(公告)号：US20240312332A1

公开(公告)日：2024-09-19

申请号：US18320611

申请日：2023-05-19

申请人： CIENA CORPORATION

发明人： Chander Prakash Gupta ,  Sardeep Heda ,  Ranjeet Chaurasiya ,  Rampratap Mahawar

IPC分类号： G08B21/18 ,  H05B45/20 ,  H05B45/30

CPC分类号： G08B21/18 ,  H05B45/20 ,  H05B45/30

摘要： Aspects of the subject disclosure may include, for example, a process for providing status indication, that includes receiving a control signal at a proximal end of an elongated flexible circuit assembly including a distal portion attached to and extending along at least a portion of an elongated, panel-facing edge of a planar circuit board. The process further includes directing the control signal around a bent portion of the elongated flexible circuit assembly and to a number of visual status indicators distributed along at least a distal end of the elongated flexible circuit assembly, wherein at least a portion of the number of visual status indicators is actuated, responsive to the control signal, to provide a visual indication of a status of equipment supported by the planar circuit board. Other embodiments are disclosed.

公开(公告)号：US20240090116A1

公开(公告)日：2024-03-14

申请号：US17975721

申请日：2022-10-28

申请人： Ciena Corporation

发明人： Chander Prakash Gupta ,  Sachin Singla ,  Ranjeet Chaurasiya ,  Rampratap Mahawar ,  Shubham Kumar

IPC分类号： H05K1/02 ,  H05K7/20

CPC分类号： H05K1/0203 ,  H05K1/0274 ,  H05K7/202 ,  H05K7/20209 ,  H05K7/2039 ,  H04B10/40

摘要： The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.

公开(公告)号：US20240292558A1

公开(公告)日：2024-08-29

申请号：US18133560

申请日：2023-04-12

申请人： Ciena Corporation

发明人： Chander Prakash Gupta ,  Sachin Singla ,  Suyash Agrawal ,  Ranjeet Chaurasiya ,  Karan Goel

IPC分类号： H05K7/14 ,  H05K5/03 ,  H05K7/20

CPC分类号： H05K7/1432 ,  H05K5/03 ,  H05K7/1407 ,  H05K7/1492 ,  H05K7/20409 ,  H05K7/209

摘要： A networking equipment enclosure assembly, including: a base chassis; a lid coupled to the base chassis; a printed circuit board disposed within the base chassis; and a power supply unit disposed between the printed circuit board and the lid, wherein the power supply unit is spaced apart from and biased away from the printed circuit board and towards the lid via a spring mechanism coupled between the printed circuit board and the power supply unit. The networking equipment enclosure assembly also includes a heat spreader plate disposed between the power supply unit and the lid and coupled to the power supply unit. The power supply unit is biased towards the lid via the spring mechanism coupled between the printed circuit board and the power supply unit such that the heat spreader plate is pressed into thermal contact with the lid.