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公开(公告)号：US20180319107A1
公开(公告)日：2018-11-08
申请号：US15920953
申请日：2018-03-14
发明人： Yuan YAO , Tzu-Heng CHIU , Rong-Yeu CHANG , Chia-Hsiang HSU , Chih-Wei WANG , Shih-Po SUN , Sung-Wei HUANG , Hsun YANG , Tsai-Heng TSAI
CPC分类号： B29C70/546 , B29C70/48 , B29K2995/0026 , G01N15/0826
摘要： The present disclosure provides a system for measuring a permeability/porosity ratio of a fiber preform in a molding system. In some embodiments of the present disclosure, the system includes a mold, a detection device, a resin-supplying source, and a computing device. The mold includes an upper mold and a lower mold forming a mold cavity. The resin-supplying source is configured to input a molding resin into a preform in the mold cavity. The detection device is configured to detect a flow front of the molding resin at a first position and a second position in the mold cavity. The computing device is configured to calculate a flowing property of the molding resin into the preform based on the first position, the second position, a travelling time of the flow front from the first position to the second position, and a pressure difference driving the flow front to travel from the first position to the second position.
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公开(公告)号：US20200061941A1
公开(公告)日：2020-02-27
申请号：US16667562
申请日：2019-10-29
发明人： Yuan YAO , Tzu-Heng CHIU , Rong-Yeu CHANG , Chia-Hsiang HSU , Chih-Wei WANG , Shih-Po SUN , Sung-Wei HUANG , Hsun YANG , Tsai-Heng TSAI
摘要： The present disclosure provides a measurement method for a molding system comprising an upper mold and a lower mold forming a mold cavity. The method includes applying a pressure difference to a molding resin for driving the molding resin to flow into a preform in the mold cavity; detecting a flow front of the molding resin at a first position and a second position in the mold cavity; and calculating a flowing property of the molding resin based on the first position, the second position, a travelling time of the flow front from the first position to the second position, and the pressure difference.
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公开(公告)号：US20210107197A1
公开(公告)日：2021-04-15
申请号：US17039460
申请日：2020-09-30
发明人： Yuing CHANG , Chih-Kang LEE , Chia-Hsiang HSU , Rong-Yeu CHANG
摘要： The present disclosure provides a clamping assembly in operative connection with a mold of an injection-molding apparatus. The clamping assembly includes a fixed plate, a rear plate, a plurality of tie bars, a movable plate, a driving module, and a temperature adjuster. The rear plate is spaced apart from the fixed plate. The tie bars are interlinked with the fixed plate and the rear plate and provided with a plurality of channels. The movable plate, between the fixed plate and the rear plate, is capable of moving with respect to the fixed plate along the tie bars. The driving module interlinks the rear plate and the movable plate. The temperature adjuster is employed to supply a fluid into the channels to remove heat from the tie bars, thereby preventing non-uniform thermal expansion of the tie bars, and hence preventing the structural wear and flash issues.
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公开(公告)号：US20210046686A1
公开(公告)日：2021-02-18
申请号：US16897816
申请日：2020-06-10
IPC分类号： B29C45/76
摘要： The present disclosure provides a molding system for preparing injection-molded articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate an anisotropic viscosity distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the anisotropic viscosity distribution of the molding resin is generated based in part on an elastic effect of the molding resin; and a controller operably communicating with the processing module and configured to control the molding machine with the molding condition using the generated anisotropic viscosity distribution of the molding resin to perform an actual molding process for preparing the injection-molded article.
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公开(公告)号：US20190152114A1
公开(公告)日：2019-05-23
申请号：US16055382
申请日：2018-08-06
摘要： The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.
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公开(公告)号：US20190030775A1
公开(公告)日：2019-01-31
申请号：US15913102
申请日：2018-03-06
摘要： A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.
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公开(公告)号：US20230058453A1
公开(公告)日：2023-02-23
申请号：US17564744
申请日：2021-12-29
发明人： Ching-Kai CHOU , Chien-Ting WU , Hsun YANG , Li-Hsuan SHEN , Chih-Chung HSU , Chia-Hsiang HSU , Rong-Yeu CHANG
摘要： The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.
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公开(公告)号：US20200376733A1
公开(公告)日：2020-12-03
申请号：US16587858
申请日：2019-09-30
摘要： A computer-implemented simulation method for use in a molding process by a computer process is disclosed. The method includes steps of specifying a simulating domain comprising a mold cavity and a barrel of an injection machine, wherein the barrel is configured to connect to the mold cavity; creating at least one mesh by dividing at least part of the simulating domain; specifying boundary conditions of the mesh by taking into consideration at least one motion of a screw in the barrel; and simulating a first injection-molding process of a molding material by using the boundary conditions to generate a plurality of molding conditions.
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公开(公告)号：US20190152113A1
公开(公告)日：2019-05-23
申请号：US16011347
申请日：2018-06-18
IPC分类号： B29C45/77
CPC分类号： B29C45/77 , B29C2945/76006 , B29C2945/7604 , B29C2945/76254 , B29C2945/76498 , B29C2945/76939 , B29C2945/76996
摘要： The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.
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