公开(公告)号：US20170335466A1

公开(公告)日：2017-11-23

申请号：US15672599

申请日：2017-08-09

Applicant: CORNING INCORPORATED

Inventor： Jeffrey John Domey ,  John Tyler Keech ,  Xinghua Li ,  Garrett Andrew Piech ,  Arie Bruce Shorey ,  Paul John Shustack ,  John Christopher Thomas

IPC: C23F4/04 ,  C03B33/10 ,  C03B33/02 ,  B23K26/386 ,  B23K26/18 ,  B23K26/0622 ,  B23K26/382 ,  H05K3/00 ,  B23K26/40 ,  B23K103/00

CPC classification number: C23F4/04 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/102 ,  H05K3/0026 ,  Y10T428/24322

Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.