公开(公告)号：US11967797B2

公开(公告)日：2024-04-23

申请号：US17061936

申请日：2020-10-02

Applicant: NUVOTON TECHNOLOGY CORPORATION JAPAN

Inventor： Daisuke Ikeda ,  Hideo Kitagawa ,  Hiroshi Asaka ,  Masayuki Ono

IPC: H01S5/00 ,  H01S5/02 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/359 ,  B23K26/386 ,  B23K103/00 ,  H01S5/042 ,  H01S5/22 ,  H01S5/323

CPC classification number: H01S5/0201 ,  H01S5/0202 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/359 ,  B23K26/386 ,  B23K2103/56 ,  H01S5/04256 ,  H01S5/22 ,  H01S5/32341

Abstract: A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction.

公开(公告)号：US09788466B2

公开(公告)日：2017-10-10

申请号：US14252717

申请日：2014-04-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Howard E. Chen

IPC: H05K7/00 ,  H05K9/00 ,  H04B1/3827 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  B23K26/362 ,  B23K26/40 ,  B23K26/386 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H05K3/30 ,  B23K26/361 ,  B23K26/382 ,  B23K103/16 ,  H01L23/00

CPC classification number: H05K1/0218 ,  B23K26/361 ,  B23K26/362 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H03H9/64 ,  H04B1/3833 ,  H04B1/3838 ,  H04B1/40 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/181 ,  H05K1/183 ,  H05K3/288 ,  H05K3/30 ,  H05K3/303 ,  H05K9/0022 ,  H05K2201/1006 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2201/1056 ,  H05K2203/107 ,  H05K2203/1327 ,  Y10T29/49002 ,  Y10T29/49016 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a module can include a packaging substrate configured to receive a plurality of components. The module can further include an RF component mounted on the packaging substrate and configured to facilitate processing of an RF signal. The module can further include an RF shield disposed relative to the RF component, with the RF shield being configured to provide shielding for the RF component. The RF shield can include at least one shielding-component configured to provide one or more electrical paths between a conductive layer on an upper surface of the module and a ground plane of the packaging substrate. The shielding-component can include a surface-mount device such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD).

公开(公告)号：US20170107605A1

公开(公告)日：2017-04-20

申请号：US15157072

申请日：2016-05-17

Applicant: Samsung Display Co., Ltd.

Inventor： Jiyun Chun

IPC: C23C14/04 ,  B23K26/384 ,  B23K26/362

CPC classification number: C23C14/042 ,  B23K26/0661 ,  B23K26/384 ,  B23K26/386 ,  C23F1/02

Abstract: A method of manufacturing a mask includes forming a first protection layer on a first surface of a mask member, the first protection layer comprising first through-holes exposing portions of the first surface; radiating, through the first through-holes, a laser beam onto the exposed portions of the first surface to form blind holes in the mask member; and providing an etchant to form second through-holes in the mask member, the second through-holes comprising the blind bores and extending from the first surface to a second surface of the mask member opposing the first surface.

公开(公告)号：US09505085B2

公开(公告)日：2016-11-29

申请号：US13992284

申请日：2012-09-17

Applicant: Magna Interiors (Europe) GMBH

Inventor： Anton Tomaj

IPC: B23K26/00 ,  B23K26/386 ,  B23K26/402 ,  B23K26/364 ,  B23K26/53 ,  B23K26/359 ,  B23K26/38 ,  B23K26/40

CPC classification number: B23K26/0087 ,  B23K26/359 ,  B23K26/364 ,  B23K26/386 ,  B23K26/389 ,  B23K26/402 ,  B23K26/53 ,  B23K2101/006 ,  B23K2101/18 ,  B23K2103/34 ,  B23K2103/42 ,  B23K2103/50 ,  F16D13/04 ,  F16D13/54

Abstract: A method for producing a linear weakening in a flat decorative material having a point-like or spot-like area of action progressing along a machining direction of a laser light beam on the decorative material. The decorative material is set transversely with respect to the machining direction in the area of action in order to obtain a different weakening depth profile on the left and right of the weakening line predefined by the machining direction.

Abstract translation: 一种在具有点状或点状作用的平面装饰材料中产生线性弱化的方法，其沿装饰材料上的激光束的加工方向进行。 装饰材料在作用区域相对于加工方向横向设置，以便获得由加工方向预定的弱化线的左右两侧的不同的弱化深度分布。

公开(公告)号：US09419667B2

公开(公告)日：2016-08-16

申请号：US14252719

申请日：2014-04-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Anthony James Lobianco ,  Howard E. Chen ,  Robert Francis Darveaux ,  Hoang Mong Nguyen ,  Matthew Sean Read ,  Lori Ann Deorio

IPC: H04B1/3827 ,  B23K26/36 ,  H05K1/02 ,  H05K1/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/362 ,  B23K26/386 ,  H05K3/28

CPC classification number: H05K1/0218 ,  B23K26/361 ,  B23K26/362 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H03H9/64 ,  H04B1/3833 ,  H04B1/3838 ,  H04B1/40 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/181 ,  H05K1/183 ,  H05K3/288 ,  H05K3/30 ,  H05K3/303 ,  H05K9/0022 ,  H05K2201/1006 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2201/1056 ,  H05K2203/107 ,  H05K2203/1327 ,  Y10T29/49002 ,  Y10T29/49016 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.

Abstract translation: 公开了与射频（RF）模块的适形涂层相关的装置和方法。 在一些实施例中，模块可以包括形成在安装在包装衬底上的RF部件上的包覆模制件。 包覆模具还可以覆盖实现为芯片尺寸表面声波（SAW）器件（CSSD）的RF滤波器的表面贴装器件（SMD）。 模块还可以包括形成在包覆模制上的导电层，并且被配置为为模块提供RF屏蔽功能。 导电层可以通过SMD电连接到封装衬底的接地平面。 可以在SMD上的包覆模制中形成一个开口; 并且导电层可以符合开口以将导电层与SMD的上表面电连接，从而便于接地连接。

公开(公告)号：US09227868B2

公开(公告)日：2016-01-05

申请号：US13779183

申请日：2013-02-27

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Hisashi Matsumoto ,  Haibin Zhang ,  Glenn Simenson

IPC: C03B21/06 ,  C03B17/06 ,  C03B21/02 ,  C03B33/09 ,  B32B3/26 ,  B23K26/40 ,  B23K26/06 ,  B23K26/08 ,  B23K26/38

CPC classification number: C03B33/091 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0821 ,  B23K26/083 ,  B23K26/382 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/50 ,  B32B3/266 ,  C03B33/0222 ,  Y10T428/24273

Abstract: Methods and apparatus for machining substrates are disclosed, as are articles formed from the separated substrates. A method of machining a substrate having a first surface and a second surface opposite the first surface can include forming a first recess in the substrate extending from the first surface toward the second surface, forming a second recess in the substrate extending from the second surface toward the first surface, and removing a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate.

Abstract translation: 公开了用于加工衬底的方法和装置，以及由分离的衬底形成的制品。 加工具有与第一表面相对的第一表面和第二表面的基板的方法可以包括在基板上形成从第一表面朝向第二表面延伸的第一凹部，在基板上形成从第二表面延伸的第二凹部朝向 所述第一表面，以及从所述第一凹部移除到所述第二凹部的基板的一部分，以在所述基板中形成开口。

公开(公告)号：US09211609B2

公开(公告)日：2015-12-15

申请号：US11319824

申请日：2005-12-28

Applicant: Islam A. Salama ,  Nathaniel R. Quick ,  Aravinda Kar

Inventor： Islam A. Salama ,  Nathaniel R. Quick ,  Aravinda Kar

IPC: B23K26/00 ,  B23K26/38 ,  B23K26/073 ,  H01L21/311 ,  H05K3/00 ,  B23K26/40

CPC classification number: B23K26/386 ,  B23K26/0734 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/30 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/31138 ,  H05K3/0026

Abstract: A method includes generating a laser beam and applying the beam to a substrate to form a via in the substrate. The laser beam has an intensity profile taken at a cross-section transverse to the direction of propagation of the beam. The intensity profile has a first substantially uniform level across an interior region of the cross-section and a second substantially uniform level across an exterior region of the cross-section. The second intensity level is greater than the first intensity level.

Abstract translation: 一种方法包括产生激光束并将光束施加到衬底以在衬底中形成通孔。 激光束具有在横向于横梁的传播方向的横截面处获得的强度分布。 强度分布在横截面的内部区域上具有第一基本上均匀的水平，并且横跨横截面的外部区域具有第二基本均匀的水平。 第二强度水平大于第一强度水平。

公开(公告)号：US09209443B2

公开(公告)日：2015-12-08

申请号：US14150846

申请日：2014-01-09

Applicant: SABIC Global Technologies B.V.

Inventor： Roy Martinus Adrianus L'Abee ,  Tony Farrell

IPC: H01M2/16 ,  H01M2/14 ,  C08F110/02 ,  B23K26/38 ,  B23K26/40 ,  H01M8/10 ,  H01G11/52 ,  H01M4/68 ,  H01G9/02

CPC classification number: H01M2/145 ,  B23K26/38 ,  B23K26/382 ,  B23K26/386 ,  B23K26/389 ,  B23K26/402 ,  B23K2103/42 ,  B23K2103/50 ,  C08F110/02 ,  H01G9/02 ,  H01G11/52 ,  H01M2/162 ,  H01M2/1653 ,  H01M2/1666 ,  H01M8/1067 ,  H01M8/1069 ,  H01M8/1079 ,  Y02E60/13 ,  Y02E60/521 ,  Y02P70/56 ,  Y10T428/24273 ,  Y10T428/24322

Abstract: The disclosure relates, in one aspect, to porous solid-state films with controlled pore structures obtained by laser perforation. A thin laser-perforated film can comprise a slab defining a plurality of pores distributed in a predetermined arrangement, the plurality of pores having a distribution of sizes bound by a predetermined magnitude. In an aspect, the plurality of pores are formed in the slab with a laser having a wavelength less than about 400 nm and the slab has a transmission of the laser light of equal to or less than about 70% measured at a thickness of the slab of 100 micrometer or less.

Abstract translation: 本公开涉及一方面涉及通过激光穿孔获得的具有受控孔结构的多孔固态膜。 薄的激光穿孔膜可以包括限定以预定布置分布的多个孔的板，所述多个孔具有以预定大小限制的尺寸分布。 在一个方面，多个孔用波长小于约400nm的激光在板坯中形成，并且板坯具有等于或小于约70％的透射率，该厚度在板坯的厚度处测量 为100微米以下。

公开(公告)号：US09193009B2

公开(公告)日：2015-11-24

申请号：US13959133

申请日：2013-08-05

Applicant: Schaeffler Technologies AG & Co. KG

Inventor： Martin Chambrion ,  Christoph Raber

IPC: F16D13/38 ,  F16D13/04 ,  B23K26/38 ,  F16D13/54

CPC classification number: F16D13/38 ,  B23K26/359 ,  B23K26/364 ,  B23K26/386 ,  B23K26/389 ,  B23K26/402 ,  B23K26/53 ,  B23K2103/34 ,  B23K2103/50 ,  F16D13/04 ,  F16D13/54 ,  B23K26/0087

Abstract: A clutch having a pre-clutch and a main clutch, where the pre-clutch can be brought to an engaged or a disengaged state by a tensioning means, the pre-clutch being connected to the main clutch by means of an operative connection in such a way that the disengaged position and the engaged position are transmitted to the main clutch, and where the tensioning means is supported on a clutch basket of the main clutch.

Abstract translation: 具有预离合器和主离合器的离合器，其中预离合器可以通过张紧装置进入接合或分离状态，前离合器通过这样的操作连接连接到主离合器 将分离位置和接合位置传递到主离合器的方式，并且其中张紧装置支撑在主离合器的离合器篮上。

公开(公告)号：US07673388B2

公开(公告)日：2010-03-09

申请号：US10983656

申请日：2004-11-09

Applicant: Hiroichi Hase

Inventor： Hiroichi Hase

IPC: B21D53/84 ,  F16C7/00

CPC classification number: F16C9/045 ,  B23D31/003 ,  B23K26/0665 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/14 ,  B23K26/386 ,  B23K26/389 ,  B23K2101/006 ,  Y10T29/49288 ,  Y10T29/4979 ,  Y10T29/49796 ,  Y10T29/49821 ,  Y10T29/49824

Abstract: This is a method of forming a fracture start portion of a ductile metal part on an inner circumferential face of a through hole by irradiating laser to an opposing position of the inner circumferential face of the thorough hole of the ductile metal part having a predetermined through hole and by forming a large number of recess portions separated with a predetermined distance at a predetermined interval from one opening to the other opening of the through hole, in which a recess part is formed, instead of by focusing the laser exactly onto the inner circumferential face of the through hole, by irradiating it onto the inner circumferential face of the through hole while defocusing from the inner circumferential face of the through hole by a predetermined amount as well as by supplying an assist gas to a position of the laser irradiation, and the laser is moved linearly at a predetermined speed from one side opening to the other side opening on the inner circumferential face of the through hole while irradiating the laser onto the inner circumferential face of the through hole at a predetermined pulse.

Abstract translation: 这是通过在具有预定通孔的延性金属部分的通孔的内周面的相对位置照射激光来在通孔的内周面上形成延性金属部分的断裂起始部分的方法 并且通过形成大量的凹部，其以形成有凹部的通孔的一个开口至另一个开口以预定间隔隔开预定距离，而不是将激光精确地聚焦到内周面上 的通孔，通过在通孔的内周面上照射预定量，并且通过向激光照射的位置供给辅助气体而将其照射在通孔的内周面上，并且 激光以预定速度从一侧开口直线移动到另一侧开口的内周面上 gh孔，同时以预定脉冲将激光照射到通孔的内周面上。