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公开(公告)号：US20190047900A1
公开(公告)日：2019-02-14
申请号：US16085759
申请日：2017-03-13
申请人： CORNING INCORPORATED
摘要： A foldable electronic device module that includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 μm to about 600 μm; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.
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公开(公告)号：US20180315953A1
公开(公告)日：2018-11-01
申请号：US15768313
申请日：2016-10-13
申请人： CORNING INCORPORATED
CPC分类号： G02F1/133305 , B32B7/12 , B32B17/00 , B32B17/06 , B32B27/06 , B32B27/281 , B32B27/36 , B32B2250/40 , B32B2250/44 , B32B2264/101 , B32B2307/412 , B32B2307/50 , B32B2307/546 , B32B2307/732 , B32B2457/20
摘要： A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
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3.发明申请公开(公告)号：US20190284082A1
公开(公告)日：2019-09-19
申请号：US16463094
申请日：2017-11-21
申请人： CORNING INCORPORATED
发明人： Olus Naili Boratav , Ahdi EI-Kahlout , Timothy L. Lansberry , Steven Michael Milillo , Eunyoung Park , Paul Maynard Schermerhorn , William Anthony Whedon
IPC分类号： C03B17/06
摘要： A forming body of a glass forming apparatus is disclosed having an upper portion, a first forming surface, and a second forming surface extending downward from the upper portion to converge at a root. The upper portion of the forming body includes a trough for receiving molten glass, the trough including a first weir, a second weir, and a base extending between weirs. Each weir has a reinforcing portion extending upward from the base towards the tops of the weirs. A width of the base of the trough at a may be less than a top width of the trough. One or more of the top width, width of the base, or angle between an inner surface of the first or second weir and a vertical plane may be constant along a trough length of the trough.
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公开(公告)号：US20190006619A1
公开(公告)日：2019-01-03
申请号：US16122009
申请日：2018-09-05
申请人： CORNING INCORPORATED
IPC分类号： H01L51/52 , G02F1/1333 , B32B17/06 , B32B27/34 , B32B27/36 , B32B7/12 , G02F1/1335 , H01L27/32
摘要： A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
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5.发明申请公开(公告)号：US20130269393A1
公开(公告)日：2013-10-17
申请号：US13916117
申请日：2013-06-12
申请人： Corning Incorporated
CPC分类号： C03B17/064 , G05B21/02
摘要： A method and apparatus for forming a glass sheet using a fusion down-draw process, wherein the heating powers of the heating elements are managed such that in case of a failure of one heating element, the heating power of the adjacent heating element is immediately increased. The method decreases the thermal stress the forming body is exposed to due to the failure of the heating element.
摘要翻译： 一种使用熔融拉伸工艺形成玻璃板的方法和装置，其中管理加热元件的加热功率，使得在一个加热元件发生故障的情况下，相邻加热元件的加热功率立即增加 。 该方法由于加热元件的故障而降低成形体暴露于热应力。
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公开(公告)号：US11104601B2
公开(公告)日：2021-08-31
申请号：US16085759
申请日：2017-03-13
申请人： CORNING INCORPORATED
摘要： A foldable electronic device module that includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 μm to about 600 μm; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.
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公开(公告)号：US11031574B2
公开(公告)日：2021-06-08
申请号：US16122009
申请日：2018-09-05
申请人： CORNING INCORPORATED
IPC分类号： H01L51/52 , B32B17/06 , G02F1/1333 , B32B7/12 , B32B27/36 , B32B27/28 , B32B27/06 , B32B17/00 , B32B27/34 , G02F1/1335 , H01L27/32
摘要： A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
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