公开(公告)号：US11186060B2

公开(公告)日：2021-11-30

申请号：US15205284

申请日：2016-07-08

Applicant: CORNING INCORPORATED

Inventor： Kristopher Allen Wieland ,  Garrett Andrew Piech ,  John Tyler Keech ,  Jeffrey Mathew Clark

IPC: B32B3/26 ,  B32B17/06 ,  B23K26/53 ,  C03C15/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/15 ,  C03B33/02 ,  C03C17/06 ,  B23K26/06 ,  B23K103/00

Abstract: Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

公开(公告)号：US20170008122A1

公开(公告)日：2017-01-12

申请号：US15205284

申请日：2016-07-08

Applicant: CORNING INCORPORATED

Inventor： Kristopher Allen Wieland ,  Garrett Andrew Piech ,  John Tyler Keech ,  Jeffrey Mathew Clark

IPC: B23K26/00 ,  B32B3/26 ,  B23K26/386 ,  B32B17/06

CPC classification number: B32B3/266 ,  B23K26/0604 ,  B23K26/53 ,  B23K2103/54 ,  B32B17/06 ,  B32B2307/412 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/06 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  Y02P40/57

Abstract: Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

Abstract translation: 在靶基板中切割和钻孔的系统和工艺使用激光器（例如脉冲激光器）和光学系统来产生激光束在诸如玻璃基板之类的目标基板内的线焦点。 激光切割和钻孔系统和工艺产生孔或缺陷，在某些实施例中，使用每个单独的激光脉冲来延伸玻璃板的整个深度，并且允许激光系统通过产生目标基板来切割和分离任何期望的轮廓 形成轮廓或期望的部件形状的一系列穿孔。 由于玻璃基片是脆性的，因此随着穿孔轮廓的开裂，允许玻璃基片分离成由穿孔限定的任何所需形状。