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1.发明授权Glass wafers for semiconductors fabrication processes and methods of making same 有权半导体制造工艺的玻璃晶片及其制造方法公开(公告)号：US09159587B2
公开(公告)日：2015-10-13
申请号：US14488943
申请日：2014-09-17
Applicant: CORNING INCORPORATED
Inventor： Joseph Eugene Canale , Jeffrey Stapleton King , Gary Richard Trott
CPC classification number: H01L21/50 , C03C17/00 , H01L21/02422 , H01L21/02444 , H01L21/0245 , H01L21/02488 , H01L21/02491 , H01L2224/16145
Abstract: The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.
Abstract translation: 本公开涉及使用玻璃晶片作为载体，中介层或其它选择的应用，其中电子电路或诸如晶体管的操作元件在形成电子器件时形成。 玻璃晶片通常包括玻璃的热膨胀系数等于或基本上等于半导体硅的热膨胀系数，分度特征和玻璃的一个面的至少一部分上的涂层。
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2.发明申请Glass Wafers for Semiconductors Fabrication Processes and Methods of Making Same 审中-公开半导体玻璃晶片制造工艺及其制作方法公开(公告)号：US20150099330A1
公开(公告)日：2015-04-09
申请号：US14488943
申请日：2014-09-17
Applicant: CORNING INCORPORATED
Inventor： Joseph Eugene Canale , Jeffrey Stapleton King , Gary Richard Trott
IPC: H01L21/50
CPC classification number: H01L21/50 , C03C17/00 , H01L21/02422 , H01L21/02444 , H01L21/0245 , H01L21/02488 , H01L21/02491 , H01L2224/16145
Abstract: The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.
Abstract translation: 本公开涉及使用玻璃晶片作为载体，中介层或其它选择的应用，其中电子电路或诸如晶体管的操作元件在形成电子器件时形成。 玻璃晶片通常包括玻璃的热膨胀系数等于或基本上等于半导体硅的热膨胀系数，分度特征和玻璃的一个面的至少一部分上的涂层。
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