Abstract:
A substrate ion exchange system, along with methods of maintain such a system, is provided that includes a substrate having an outer region containing a plurality of substrate metal ions, an ion exchange bath that includes a plurality of first metal ions at a first metal ion concentration and a plurality of second metal ions at a second metal ion concentration, and a vessel for containing the ion exchange bath and the substrate. The ion exchange system also includes a temperature sensor coupled to the vessel, and a processor configured to receive a vessel temperature from the sensor and to evaluate the first metal ion concentration based at least in part on a first metal ion consumption rate relationship and the vessel temperature. Further, the first metal ion consumption rate relationship is predetermined.
Abstract:
A method for optimizing ion exchange of glass. The glass is ion exchanged in a series of two ion exchange baths. The first ion exchange bath contains an amount of a poisoning ion or salt and the second ion exchange bath contains an amount of the poisoning ion or salt that is less than that in the first bath. When the concentration of the poisoning ion/salt in the first bath reaches a maximum value, the first bath is discarded and replaced by the second bath and a third bath that initially does not contain the poisoning cation/salt replaces the second ion exchange bath. This cycling of baths may be repeated to produce a plurality of glass articles, each having a surface layer under a compressive stress and depth of layer that are within predetermined limits.
Abstract:
The disclosure is directed to a method for controlling the sludge that is generated during the wet acid etching of glass articles. The four Factors that need to be controlled are (i) the dissolved glass level A; (ii) the HF concentration B; (iii) the second acid concentration C, the second acid being a strong acid, and (iv) the solubility constant D of the precipitate, Ksp, which is controlled by changing temperature or ionic strength. The disclosed method utilized HF as the etchant and a strong acid selected from the group consisting of HCI, H2SO4.HNO3 and HCIO4.
Abstract:
The disclosure is directed to a method for controlling the sludge that is generated during the wet acid etching of glass articles. The four Factors that need to be controlled are (i) the dissolved glass level A; (ii) the HF concentration B; (iii) the second acid concentration C, the second acid being a strong acid, and (iv) the solubility constant D of the precipitate, Ksp, which is controlled by changing temperature or ionic strength. The disclosed method utilized HF as the etchant and a strong acid selected from the group consisting of HCI, H2SO4.HNO3 and HCIO4.
Abstract:
Described herein are various methods and manufacturing methods for making antimicrobial and strengthened, antimicrobial glass articles and substrates. The methods described herein generally include contacting the article with a KNO3-containing molten salt bath set at about 380 C to about 460 C for about 30 minutes to about 24 hours to form a compressive stress layer that extends inward from a surface of the glass substrate to a first depth; and contacting the article comprising the compressive stress layer with a AgNO3-containing molten salt bath set at about 300° C. to about 400° C. for about 5 minutes to about 18 hours to form an antimicrobial region that extends inward from the surface of the glass substrate to a second depth. The methods also include poisoning at least the AgNO3-containing molten salt bath and, in some cases, the KNO3-containing molten salt bath. Poisoning components include Na+ and Li+ ions.
Abstract:
Described herein are various methods and manufacturing methods for making antimicrobial and strengthened, antimicrobial glass articles and substrates. The methods described herein generally include contacting the article with a KNO3-containing molten salt bath set at about 380 C to about 460 C for about 30 minutes to about 24 hours to form a compressive stress layer that extends inward from a surface of the glass substrate to a first depth; and contacting the article comprising the compressive stress layer with a AgNO3-containing molten salt bath set at about 300° C. to about 400° C. for about 5 minutes to about 18 hours to form an antimicrobial region that extends inward from the surface of the glass substrate to a second depth. The methods also include poisoning at least the AgNO3-containing molten salt bath and, in some cases, the KNO3-containing molten salt bath. Poisoning components include Na+ and Li+ ions.
Abstract:
A substrate ion exchange system, along with methods of maintain such a system, is provided that includes a substrate having an outer region containing a plurality of substrate metal ions, an ion exchange bath that includes a plurality of first metal ions at a first metal ion concentration and a plurality of second metal ions at a second metal ion concentration, and a vessel for containing the ion exchange bath and the substrate. The ion exchange system also includes a temperature sensor coupled to the vessel, and a processor configured to receive a vessel temperature from the sensor and to evaluate the first metal ion concentration based at least in part on a first metal ion consumption rate relationship and the vessel temperature. Further, the first metal ion consumption rate relationship is predetermined.