公开(公告)号：US20130342096A1

公开(公告)日：2013-12-26

申请号：US14010828

申请日：2013-08-27

Applicant: CREE, INC.

Inventor： BERND KELLER ,  BENJAMIN JACOBSON ,  ROBERT GENGELBACH

IPC: F21K99/00

CPC classification number: H01L33/58 ,  F21K9/60 ,  F21K9/61 ,  F21Y2115/10 ,  G02B6/4214 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60

Abstract: An LED package includes a LED structure that outputs light in a pattern about an axis and an optical coupling device with a central axis. The coupling device is positioned relative to the LED structure and accepts light from the LED. The coupling device includes a first dielectric interface surface that is substantially cylindrical with respect to the central axis, and a reflecting surface. The first dielectric interface surface accepts a first portion of light from the LED structure and directs it toward the reflecting surface. The reflecting surface accepts the light from the first dielectric interface surface and directs it toward the first dielectric interface surface in a direction substantially perpendicular to the central axis.

Abstract translation: LED封装包括以围绕轴线的图案输出的LED结构和具有中心轴线的光耦合装置。 联接装置相对于LED结构定位并且接受来自LED的光。 耦合装置包括相对于中心轴线基本上为圆柱形的第一电介质界面表面和反射表面。 第一电介质界面表面接受来自LED结构的第一部分光并将其引向反射表面。 反射表面接受来自第一介电接口表面的光，并将其引向基本上垂直于中心轴线的方向上的第一介电界面。