公开(公告)号：US20130328074A1

公开(公告)日：2013-12-12

申请号：US13770389

申请日：2013-02-19

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  ERIC TARSA ,  STEN HEIKMAN ,  BERND KELLER ,  JESSE REIHERZER ,  HORMOZ BENJAMIN

IPC: H01L27/15

CPC classification number: H01L27/15 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or a plurality of LEDs. In packages with a plurality of LEDs, each LED can emit the same or different wavelengths of light. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant with planar surfaces can be on the submount, over at least some of the LEDs, with the planar surfaces causing total internal reflection of light within the package. TIR light within the encapsulant can reach the conversion material, where it can be absorbed and emitted omnidirectionally. TIR light can now escape from the encapsulant and allow for efficient emission and a broader emission profile when compared to conventional packages with hemispheric encapsulants.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座。 在具有多个LED的封装中，每个LED可以发射相同或不同波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 具有平坦表面的密封剂可以在基座上，至少一些LED上，平面表面引起光在封装内的全部内部反射。 密封剂内的TIR光可以到达转化材料，在那里它可以被全方位地吸收和发射。 与现有的具有半球密封剂的包装相比，TIR灯现在可以从密封剂中排出并且能够有效排放和更宽的排放特征。

公开(公告)号：US20130329425A1

公开(公告)日：2013-12-12

申请号：US13649052

申请日：2012-10-10

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  ERIC J. TARSA ,  STEN HEIKMAN ,  BERND KELLER ,  JESSE REIHERZER ,  HORMOZ BENJAMIN

IPC: F21V9/00

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座，以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

公开(公告)号：US20150236219A1

公开(公告)日：2015-08-20

申请号：US14705228

申请日：2015-05-06

Applicant: CREE, INC.

Inventor： BERND KELLER ,  Thomas Cheng-Hsin Yuan ,  Nicholas W. Medendorp, JR.

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/64

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.

Abstract translation: 一种LED封装，包括具有在其顶表面上具有多个顶部导电和导热元件的顶表面和底表面的底座。 顶部元件之一中包括LED，使得施加到顶部元件的电信号使得LED发光。 导电元件还将散热的LED从跨越大多数的底座顶面传播。 底部导热元件包括在所述底座的底表面上并且从底座散热，并且在LED上直接形成透镜。 一种用于制造LED封装的方法，包括提供尺寸被分成多个LED封装底座的底座面板。 顶部导电元件形成在用于多个LED封装的基座面板的一个表面上，并且LED附接到顶部元件。 在LED上模制透镜，并且衬底面板被分割成多个LED封装。

公开(公告)号：US20150233544A1

公开(公告)日：2015-08-20

申请号：US14185123

申请日：2014-02-20

Applicant: CREE, INC.

Inventor： DEBORAH KIRCHER ,  THEODORE LOWES ,  PAUL T. FINI ,  BERND KELLER

IPC: F21V9/16 ,  F21K99/00 ,  H01L33/50

CPC classification number: F21V9/30 ,  F21K9/64 ,  F21K9/90 ,  F21V29/502 ,  H01L33/507 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Lighting components and fixtures having optical elements with multiple portions are disclosed. A wavelength conversion element can be mounted over a source, the wavelength conversion element including wavelength conversion material remote to the source, such as on or near the outside surface of a conversion element. The element can be filled with a transparent and thermally conductive material which thermally couples the remote conversion material and the source, aiding in thermal dissipation and improving fixture efficacy. An optical element can be formed by using an embossing plate to form a first portion, partially curing the first portion, removing the embossing plate, and introducing material to form a second portion.

Abstract translation: 公开了具有多个部分的光学元件的照明部件和固定装置。 波长转换元件可以安装在源上，波长转换元件包括远离源的波长转换材料，诸如在转换元件的外表面上或附近。 该元件可以用透明导热材料填充，其热耦合远程转换材料和源，有助于散热并提高固定效能。 光学元件可以通过使用压花板来形成第一部分，部分地固化第一部分，去除压纹板，以及引入材料以形成第二部分。

公开(公告)号：US20130342096A1

公开(公告)日：2013-12-26

申请号：US14010828

申请日：2013-08-27

Applicant: CREE, INC.

Inventor： BERND KELLER ,  BENJAMIN JACOBSON ,  ROBERT GENGELBACH

IPC: F21K99/00

CPC classification number: H01L33/58 ,  F21K9/60 ,  F21K9/61 ,  F21Y2115/10 ,  G02B6/4214 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60

Abstract: An LED package includes a LED structure that outputs light in a pattern about an axis and an optical coupling device with a central axis. The coupling device is positioned relative to the LED structure and accepts light from the LED. The coupling device includes a first dielectric interface surface that is substantially cylindrical with respect to the central axis, and a reflecting surface. The first dielectric interface surface accepts a first portion of light from the LED structure and directs it toward the reflecting surface. The reflecting surface accepts the light from the first dielectric interface surface and directs it toward the first dielectric interface surface in a direction substantially perpendicular to the central axis.

Abstract translation: LED封装包括以围绕轴线的图案输出的LED结构和具有中心轴线的光耦合装置。 联接装置相对于LED结构定位并且接受来自LED的光。 耦合装置包括相对于中心轴线基本上为圆柱形的第一电介质界面表面和反射表面。 第一电介质界面表面接受来自LED结构的第一部分光并将其引向反射表面。 反射表面接受来自第一介电接口表面的光，并将其引向基本上垂直于中心轴线的方向上的第一介电界面。