公开(公告)号：US20200303107A1

公开(公告)日：2020-09-24

申请号：US16821014

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  YU-HSIN LIN

IPC: H01F5/06 ,  H01F5/04 ,  H01F41/076 ,  H01F41/063 ,  H05K1/11

Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

公开(公告)号：US20230411057A1

公开(公告)日：2023-12-21

申请号：US18241916

申请日：2023-09-04

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  YU-HSIN LIN

IPC: H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/18

CPC classification number: H01F5/06 ,  H01F5/04 ,  H05K1/118 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/182 ,  H01F2027/065 ,  H05K2201/1003 ,  H05K1/112

Abstract: A coil structure comprises a coil and a conductive terminal part, wherein the coil is formed by a conductive wire comprising a metal wire and at least one insulating layer encapsulating the metal wire, wherein a first terminal part of the metal wire is exposed from the at least one insulating layer, wherein a first portion of the conductive terminal part encapsulates the first terminal part of the metal wire and a second portion of the conductive terminal part extends from said first portion as an electrode for electrically connecting to an external circuit.