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公开(公告)号：US20220157512A1
公开(公告)日：2022-05-19
申请号：US17317904
申请日：2021-05-12
Applicant: CYNTEC CO., LTD.
Inventor： Min-Feng Chung , Kuan Yu Chiu , Ching Hsiang Yu
Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.
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公开(公告)号：US11798735B2
公开(公告)日：2023-10-24
申请号：US17148537
申请日：2021-01-13
Applicant: CYNTEC CO., LTD.
Inventor： Kuan Yu Chiu , Ching Hsiang Yu , Min-Feng Chung
IPC: H01F27/28 , H01F38/14 , H02J7/02 , H02J50/10 , H02J50/40 , H01F27/32 , H02J7/00 , H01F27/34 , H04M1/02
CPC classification number: H01F38/14 , H01F27/288 , H01F27/327 , H01F27/346 , H02J7/0013 , H02J7/0042 , H02J7/02 , H02J50/10 , H02J50/402 , H04M1/0202
Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.
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Patent Agency Ranking
公开(公告)号：US20200303107A1
公开(公告)日：2020-09-24
申请号：US16821014
申请日：2020-03-17
Applicant: CYNTEC CO., LTD.
Inventor： Min-Feng Chung , Ching Hsiang Yu , Kuan Yu Chiu , YU-HSIN LIN
IPC: H01F5/06 , H01F5/04 , H01F41/076 , H01F41/063 , H05K1/11
Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.
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公开(公告)号：US12183499B2
公开(公告)日：2024-12-31
申请号：US17317904
申请日：2021-05-12
Applicant: CYNTEC CO., LTD.
Inventor： Min-Feng Chung , Kuan Yu Chiu , Ching Hsiang Yu
IPC: H01Q7/06 , H01F27/24 , H01F27/28 , H01F27/32 , H01F41/04 , H01Q7/08 , H02J7/00 , H02J50/10 , H02J50/70 , H05K7/20 , H10N10/00
Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.
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公开(公告)号：US20230411057A1
公开(公告)日：2023-12-21
申请号：US18241916
申请日：2023-09-04
Applicant: CYNTEC CO., LTD.
Inventor： Min-Feng Chung , Ching Hsiang Yu , Kuan Yu Chiu , YU-HSIN LIN
IPC: H01F5/06 , H01F5/04 , H05K1/11 , H01F41/063 , H01F41/076 , H01F27/06 , H05K1/18
CPC classification number: H01F5/06 , H01F5/04 , H05K1/118 , H01F41/063 , H01F41/076 , H01F27/06 , H05K1/182 , H01F2027/065 , H05K2201/1003 , H05K1/112
Abstract: A coil structure comprises a coil and a conductive terminal part, wherein the coil is formed by a conductive wire comprising a metal wire and at least one insulating layer encapsulating the metal wire, wherein a first terminal part of the metal wire is exposed from the at least one insulating layer, wherein a first portion of the conductive terminal part encapsulates the first terminal part of the metal wire and a second portion of the conductive terminal part extends from said first portion as an electrode for electrically connecting to an external circuit.
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公开(公告)号：US11791079B2
公开(公告)日：2023-10-17
申请号：US16821014
申请日：2020-03-17
Applicant: CYNTEC CO., LTD.
Inventor： Min-Feng Chung , Ching Hsiang Yu , Kuan Yu Chiu , Yu-Hsin Lin
IPC: H01F5/00 , H01F5/06 , H01F5/04 , H05K1/11 , H01F41/063 , H01F41/076 , H01F27/06 , H05K1/18
CPC classification number: H01F5/06 , H01F5/04 , H01F27/06 , H01F41/063 , H01F41/076 , H05K1/118 , H05K1/182 , H01F2027/065 , H05K1/112 , H05K2201/1003
Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.
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公开(公告)号：US20210217556A1
公开(公告)日：2021-07-15
申请号：US17148537
申请日：2021-01-13
Applicant: CYNTEC CO., LTD.
Inventor： Kuan Yu Chiu , Ching Hsiang Yu , Min-Feng Chung
Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.
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