公开(公告)号：US20200303107A1

公开(公告)日：2020-09-24

申请号：US16821014

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  YU-HSIN LIN

IPC: H01F5/06 ,  H01F5/04 ,  H01F41/076 ,  H01F41/063 ,  H05K1/11

Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

公开(公告)号：US20220157512A1

公开(公告)日：2022-05-19

申请号：US17317904

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Kuan Yu Chiu ,  Ching Hsiang Yu

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/04 ,  H01F27/32

Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.

公开(公告)号：US11798735B2

公开(公告)日：2023-10-24

申请号：US17148537

申请日：2021-01-13

Applicant: CYNTEC CO., LTD.

Inventor： Kuan Yu Chiu ,  Ching Hsiang Yu ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F38/14 ,  H02J7/02 ,  H02J50/10 ,  H02J50/40 ,  H01F27/32 ,  H02J7/00 ,  H01F27/34 ,  H04M1/02

CPC classification number: H01F38/14 ,  H01F27/288 ,  H01F27/327 ,  H01F27/346 ,  H02J7/0013 ,  H02J7/0042 ,  H02J7/02 ,  H02J50/10 ,  H02J50/402 ,  H04M1/0202

Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.

公开(公告)号：US12183499B2

公开(公告)日：2024-12-31

申请号：US17317904

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Kuan Yu Chiu ,  Ching Hsiang Yu

IPC: H01Q7/06 ,  H01F27/24 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01Q7/08 ,  H02J7/00 ,  H02J50/10 ,  H02J50/70 ,  H05K7/20 ,  H10N10/00

Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.

公开(公告)号：US11601015B2

公开(公告)日：2023-03-07

申请号：US17583184

申请日：2022-01-24

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu ,  Kuan Yu Chiu ,  Chien-Hui Chen ,  Yen-Ming Liu

IPC: H02J50/00 ,  H02J50/40 ,  H02J50/10

Abstract: A wireless charger, comprising: a thermal-conductive plastic cover; a first circuit board; and a metallic case, wherein the first circuit board are disposed in the metallic case, wherein a wind tunnel is formed between the thermal-conductive plastic cover and the circuit board for lowering the temperature of an electronic device that is wirelessly charged on the thermal-conductive plastic cover.

公开(公告)号：US20220239152A1

公开(公告)日：2022-07-28

申请号：US17583184

申请日：2022-01-24

Applicant: CYNTEC CO., LTD.

Inventor： TSUNG-CHAN WU ,  Kuan Yu Chiu ,  Chien-Hui Chen ,  Yen-Ming Liu

IPC: H02J50/00

Abstract: A wireless charger, comprising: a thermal-conductive plastic cover; a first circuit board; and a metallic case, wherein the first circuit board are disposed in the metallic case, wherein a wind tunnel is formed between the thermal-conductive plastic cover and the circuit board for lowering the temperature of an electronic device that is wirelessly charged on the thermal-conductive plastic cover.

公开(公告)号：US20230411057A1

公开(公告)日：2023-12-21

申请号：US18241916

申请日：2023-09-04

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  YU-HSIN LIN

IPC: H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/18

CPC classification number: H01F5/06 ,  H01F5/04 ,  H05K1/118 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/182 ,  H01F2027/065 ,  H05K2201/1003 ,  H05K1/112

Abstract: A coil structure comprises a coil and a conductive terminal part, wherein the coil is formed by a conductive wire comprising a metal wire and at least one insulating layer encapsulating the metal wire, wherein a first terminal part of the metal wire is exposed from the at least one insulating layer, wherein a first portion of the conductive terminal part encapsulates the first terminal part of the metal wire and a second portion of the conductive terminal part extends from said first portion as an electrode for electrically connecting to an external circuit.

公开(公告)号：US11791079B2

公开(公告)日：2023-10-17

申请号：US16821014

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  Yu-Hsin Lin

IPC: H01F5/00 ,  H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/18

CPC classification number: H01F5/06 ,  H01F5/04 ,  H01F27/06 ,  H01F41/063 ,  H01F41/076 ,  H05K1/118 ,  H05K1/182 ,  H01F2027/065 ,  H05K1/112 ,  H05K2201/1003

Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

公开(公告)号：US20220399754A1

公开(公告)日：2022-12-15

申请号：US17837058

申请日：2022-06-10

Applicant: CYNTEC CO., LTD.

Inventor： Kuan Yu Chiu

IPC: H02J50/00 ,  H02J7/00 ,  H02J50/10 ,  H02J50/40

Abstract: a wireless charger having coils disposed in a recess of a metallic case of the wireless charger, wherein a heat-conducting material is disposed in the recess to encapsulate the coils with the first heat-conducting material being in contact with the coils, a sidewall, and a bottom surface of the recess.

公开(公告)号：US20210217556A1

公开(公告)日：2021-07-15

申请号：US17148537

申请日：2021-01-13

Applicant: CYNTEC CO., LTD.

Inventor： Kuan Yu Chiu ,  Ching Hsiang Yu ,  Min-Feng Chung

IPC: H01F38/14 ,  H02J7/02 ,  H02J50/10 ,  H02J50/40 ,  H02J7/00 ,  H01F27/32 ,  H01F27/28 ,  H01F27/34

Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.