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公开(公告)号：US09420705B2
公开(公告)日：2016-08-16
申请号：US13965737
申请日：2013-08-13
Applicant: CYNTEC CO., LTD.
Inventor： Yi-Geng Li , Chung-Hsiung Wang , Hung-Ming Lin
IPC: H05K3/40 , H01L23/498 , H01L33/62 , H05K1/02 , H01L33/48 , H01L23/15 , H05K1/11 , H05K1/16 , H05K1/18
CPC classification number: H05K3/4061 , H01L23/15 , H01L23/49827 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H05K1/0293 , H05K1/116 , H05K1/167 , H05K1/181 , H05K2201/10106 , H05K2203/049 , H01L2924/00014 , H01L2924/00
Abstract: A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path.
Abstract translation: 提供了包括基板，通孔，电极层和导体结构的电流传导元件。 通孔设置在基板上并具有第一开口。 电极层设置在基板上。 第一开口的一部分从电极层露出。 导体结构设置在通孔中并与电极层接触。 电极层和导体结构形成电流传导路径。
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公开(公告)号：US11067606B2
公开(公告)日：2021-07-20
申请号：US16538848
申请日：2019-08-13
Applicant: CYNTEC CO., LTD.
Inventor： Yi-Geng Li , Ming-Chia Wu , Siao-Wei Syu , Chun-Chuan Chen
Abstract: A current sensing module for measuring a current includes a conductive substrate, a frame, a circuit board and a magnetic sensor. The conductive substrate has two terminals and at least one slot. The frame has two side portions and a bottom portion, wherein the bottom portion connects the two side portions to form an opening ring-shape. At least one of the two side portions is disposed in the at least one slot, such that the two side portions surround a partial path of the current. A gap exists between two top ends of the two side portions. The circuit board is disposed with respect to the conductive substrate. The magnetic sensor is connected to the circuit board and located in a space between the two side portions rather than in the gap. The magnetic sensor senses the current and generates a first current sensing signal correspondingly.
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公开(公告)号：US20200064380A1
公开(公告)日：2020-02-27
申请号：US16538848
申请日：2019-08-13
Applicant: CYNTEC CO., LTD.
Inventor： Yi-Geng Li , Ming-Chia Wu , Siao-Wei Syu , Chun-Chuan Chen
Abstract: A current sensing module for measuring a current includes a conductive substrate, a frame, a circuit board and a magnetic sensor. The conductive substrate has two terminals and at least one slot. The frame has two side portions and a bottom portion, wherein the bottom portion connects the two side portions to form an opening ring-shape. At least one of the two side portions is disposed in the at least one slot, such that the two side portions surround a partial path of the current. A gap exists between two top ends of the two side portions. The circuit board is disposed with respect to the conductive substrate. The magnetic sensor is connected to the circuit board and located in a space between the two side portions rather than in the gap. The magnetic sensor senses the current and generates a first current sensing signal correspondingly.
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公开(公告)号：US20140327031A1
公开(公告)日：2014-11-06
申请号：US13965737
申请日：2013-08-13
Applicant: CYNTEC CO., LTD.
Inventor： Yi-Geng Li , Chung-Hsiung Wang , Hung-Ming Lin
CPC classification number: H05K3/4061 , H01L23/15 , H01L23/49827 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H05K1/0293 , H05K1/116 , H05K1/167 , H05K1/181 , H05K2201/10106 , H05K2203/049 , H01L2924/00014 , H01L2924/00
Abstract: A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path.
Abstract translation: 提供了包括基板，通孔，电极层和导体结构的电流传导元件。 通孔设置在基板上并具有第一开口。 电极层设置在基板上。 第一开口的一部分从电极层露出。 导体结构设置在通孔中并与电极层接触。 电极层和导体结构形成电流传导路径。
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