Abstract:
A curable matrix resin composition containing a thermoset resin component and metastable thermoplastic particles, wherein the metastable thermoplastic particles are particles of semi-crystalline thermoplastic material with an amorphous polymer fraction that will undergo crystallization upon heating to a crystallization temperature Tc. A fiber-reinforced polymeric composite material containing metastable thermoplastic particles is also disclosed.
Abstract:
A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.
Abstract:
A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.
Abstract:
A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.