公开(公告)号：US20140135443A1

公开(公告)日：2014-05-15

申请号：US14076640

申请日：2013-11-11

Applicant: Cytec Industries Inc.

Inventor： Vincent J. J. G. AERTS ,  Mark BONNEAU ,  Judith ELDER ,  Emiliano FRULLONI ,  James Martin GRIFFIN

IPC: C08L63/00

CPC classification number: C08L63/00 ,  C08G59/32 ,  C08G59/3227 ,  C08G59/40 ,  C08K5/0025 ,  C08K5/41 ,  C08L77/02 ,  C08L77/06

Abstract: A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.

Abstract translation: 一种树脂体系，其包括：（i）热固性树脂前体组分，其包含一种或多种官能度至少为3的多官能环氧树脂前体，优选其中所述前体选自三官能环氧树脂 前体和/或四官能环氧树脂前体; （ii）热塑性聚酰胺颗粒组分，其中聚酰胺颗粒具有熔融温度TPA; 和（iii）一种或多种固化剂，其中选择树脂前体组分，热塑性颗粒和固化剂，使得在树脂体系的固化循环期间环氧基体的凝胶化发生在凝胶化 温度TGEL等于或低于TPA。

公开(公告)号：US20190169422A1

公开(公告)日：2019-06-06

申请号：US16256005

申请日：2019-01-24

Applicant: CYTEC INDUSTRIES INC.

Inventor： Vincent AERTS ,  Mark BONNEAU ,  Judith ELDER ,  Emiliano FRULLONI ,  James Martin GRIFFIN

IPC: C08L63/00 ,  C08K5/41 ,  C08K5/00 ,  C08G59/32 ,  C08L77/02 ,  C08G59/40 ,  C08L77/06

Abstract: A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.

公开(公告)号：US20210002476A1

公开(公告)日：2021-01-07

申请号：US17025053

申请日：2020-09-18

Applicant: Cytec Industries Inc.

Inventor： Vincent AERTS ,  Mark BONNEAU ,  Judith ELDER ,  Emiliano FRULLONI ,  James Martin GRIFFIN

IPC: C08L63/00 ,  C08L77/02 ,  C08L77/06 ,  C08G59/32 ,  C08G59/40 ,  C08K5/00 ,  C08K5/41

Abstract: A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.