Abstract:
A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.
Abstract:
A curable prepreg ply formed by applying two outer resin films to the top and bottom surfaces, respectively, of a layer of resin-impregnated reinforcement fibers. The outer resin films contains insoluble toughening particles, and partially soluble or swellable toughening particles, but the resin matrix which impregnates the reinforcement fibers does not contain the same toughening particles. The insoluble toughening particles are insoluble in the resin matrix of the resin films upon curing of the prepreg ply. The partially soluble or swellabbe toughening particles are partially soluble or swellable in the resin matrix of the resin films upon curing of the prepreg ply, but remain as discreet particles after curing.
Abstract:
A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.
Abstract:
A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.
Abstract:
A curable prepreg ply formed by applying two outer resin films to the top and bottom surfaces, respectively, of a layer of resin-impregnated reinforcement fibers. The outer resin films contains insoluble toughening particles, and partially soluble or swellable toughening particles, but the resin matrix which impregnates the reinforcement fibers does not contain the same toughening particles. The insoluble toughening particles are insoluble in the resin matrix of the resin films upon curing of the prepreg ply. The partially soluble or swellable toughening particles are partially soluble or swellable in the resin matrix of the resin films upon curing of the prepreg ply, but remain as discreet particles after curing.