专利检索 ap:("Cabot Microelectronics Corporation") AND inv:"Andrew Haerle" 第 1 页

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发明申请
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS 审中-公开

公开(公告)号：US20180298234A1

公开(公告)日：2018-10-18

申请号：US15951358

申请日：2018-04-12

申请人： Cabot Microelectronics Corporation

发明人： Lu Tian , Ke Zhang , Andrew Haerle , Hon Wu Lau

IPC分类号： C09G1/02 , H01L21/321

摘要： Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel-containing substrate surfaces such as nickel phosphorus (NiP) surfaces for hard disk applications, wherein the compositions contain highly irregular-shaped fused silica abrasive particles.