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公开(公告)号：US20180298234A1
公开(公告)日：2018-10-18
申请号：US15951358
申请日：2018-04-12
Applicant: Cabot Microelectronics Corporation
Inventor： Lu Tian , Ke Zhang , Andrew Haerle , Hon Wu Lau
IPC: C09G1/02 , H01L21/321
Abstract: Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel-containing substrate surfaces such as nickel phosphorus (NiP) surfaces for hard disk applications, wherein the compositions contain highly irregular-shaped fused silica abrasive particles.
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