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1.发明申请公开(公告)号：US20150114929A1
公开(公告)日：2015-04-30
申请号：US14515723
申请日：2014-10-16
CPC分类号： C09G1/02 , B24B37/044 , G11B5/8404 , H01L21/30625
摘要： The invention provides a polishing composition that contains (a) α-alumina particles that have an average particle size of about 250 nm to about 300 nm, (b) a per-type oxidizing agent, (c) a complexing agent, wherein the complexing agent is an amino acid or an organic acid, and (d) water. The invention also provides a method of polishing a substrate, especially a nickel-phosphorous substrate, with the polishing composition.
摘要翻译： 本发明提供了一种抛光组合物，其含有（a）平均粒度为约250nm至约300nm的α-氧化铝颗粒，（b）每种型氧化剂，（c）络合剂，其中络合 药剂是氨基酸或有机酸，和（d）水。 本发明还提供了用抛光组合物抛光基底，特别是镍 - 磷基底的方法。
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2.发明授权公开(公告)号：US10792785B2
公开(公告)日：2020-10-06
申请号：US15615591
申请日：2017-06-06
发明人： Ke Zhang
摘要： Described are slurry compositions useful in chemical-mechanical processing of a nickel layer of a substrate, wherein the slurry compositions contain abrasive particles that include silica particles that are cationically charged at a low pH.
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公开(公告)号：US09469787B2
公开(公告)日：2016-10-18
申请号：US14881837
申请日：2015-10-13
摘要： A chemical mechanical polishing (CMP) composition for planarizing a nickel phosphorus (NiP) substrate comprises a suspension of colloidal silica particles and fused silica particles in an acidic aqueous carrier containing hydrogen peroxide, in which the concentration of the fused silica particles is less than or equal to the concentration of the colloidal silica particles. In some embodiments, the CMP composition includes a primary complexing agent, a secondary complexing agent, and a metal ion such as ferric ion, which is capable of reversible oxidation and reduction in the presence of hydrogen peroxide and NiP.
摘要翻译： 用于平面化镍磷（NiP）衬底的化学机械抛光（CMP）组合物包括胶体二氧化硅颗粒和熔融二氧化硅颗粒在含有过氧化氢的酸性含水载体中的悬浮液，其中熔融二氧化硅颗粒的浓度小于或等于 等于胶体二氧化硅颗粒的浓度。 在一些实施方案中，CMP组合物包括主要络合剂，仲络合剂和金属离子如铁离子，其能够在过氧化氢和NiP存在下能够可逆地氧化和还原。
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4.发明申请公开(公告)号：US20150152289A1
公开(公告)日：2015-06-04
申请号：US14094921
申请日：2013-12-03
发明人： Ke Zhang , Michael White , Tsung-Ho Lee , Steven Grumbine , Hon-Wu Lau
CPC分类号： C09G1/02 , C09G1/18 , C23F3/06 , H01L21/304 , H01L21/30625 , H01L21/32115 , H01L21/3212
摘要： Chemical mechanical polishing (CMP) compositions and methods for planarizing a nickel phosphorus (NiP) substrate are described. A NiP CMP method comprises abrading a surface of the substrate with a CMP composition. The CMP composition comprises a colloidal silica abrasive suspended in an aqueous carrier having a pH of less than 2, and containing a primary oxidizing agent comprising hydrogen peroxide, a secondary oxidizing agent comprising a metal ion capable of reversible oxidation and reduction in the presence of NiP and hydrogen peroxide, a chelating agent, and glycine. The chelating agent comprises two or three carboxylic acid substituents capable of chelating to the metal ion of the secondary oxidizing agent.
摘要翻译： 描述了用于平面化镍磷（NiP）衬底的化学机械抛光（CMP）组合物和方法。 NiP CMP方法包括用CMP组合物研磨衬底的表面。 CMP组合物包含悬浮在pH小于2的水性载体中的胶体二氧化硅磨料，并且含有包含过氧化氢的初级氧化剂，包含能够在NiP存在下可逆可氧化和还原的金属离子的二次氧化剂 和过氧化氢，螯合剂和甘氨酸。 螯合剂包含能够与二次氧化剂的金属离子螯合的两个或三个羧酸取代基。
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公开(公告)号：US10358579B2
公开(公告)日：2019-07-23
申请号：US14094921
申请日：2013-12-03
发明人： Ke Zhang , Michael White , Tsung-Ho Lee , Steven Grumbine , Hon-Wu Lau
IPC分类号： G09G1/18 , C23F3/06 , C09G1/02 , H01L21/304 , H01L21/306 , H01L21/321 , C09G1/18
摘要： Chemical mechanical polishing (CMP) compositions and methods for planarizing a nickel phosphorus (NiP) substrate are described. A NiP CMP method comprises abrading a surface of the substrate with a CMP composition. The CMP composition comprises a colloidal silica abrasive suspended in an aqueous carrier having a pH of less than 2, and containing a primary oxidizing agent comprising hydrogen peroxide, a secondary oxidizing agent comprising a metal ion capable of reversible oxidation and reduction in the presence of NiP and hydrogen peroxide, a chelating agent, and glycine. The chelating agent comprises two or three carboxylic acid substituents capable of chelating to the metal ion of the secondary oxidizing agent.
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公开(公告)号：US20180298234A1
公开(公告)日：2018-10-18
申请号：US15951358
申请日：2018-04-12
发明人： Lu Tian , Ke Zhang , Andrew Haerle , Hon Wu Lau
IPC分类号： C09G1/02 , H01L21/321
摘要： Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel-containing substrate surfaces such as nickel phosphorus (NiP) surfaces for hard disk applications, wherein the compositions contain highly irregular-shaped fused silica abrasive particles.
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7.发明授权公开(公告)号：US09534147B2
公开(公告)日：2017-01-03
申请号：US14515723
申请日：2014-10-16
IPC分类号： C09G1/02 , B24B37/04 , H01L21/306 , G11B5/84
CPC分类号： C09G1/02 , B24B37/044 , G11B5/8404 , H01L21/30625
摘要： The invention provides a polishing composition that contains (a) α-alumina particles that have an average particle size of about 250 nm to about 300 nm, (b) a per-type oxidizing agent, (c) a complexing agent, wherein the complexing agent is an amino acid or an organic acid, and (d) water. The invention also provides a method of polishing a substrate, especially a nickel-phosphorous substrate, with the polishing composition.
摘要翻译： 本发明提供了一种抛光组合物，其含有（a）平均粒度为约250nm至约300nm的α-氧化铝颗粒，（b）每种型氧化剂，（c）络合剂，其中络合 药剂是氨基酸或有机酸，和（d）水。 本发明还提供了用抛光组合物抛光基底，特别是镍 - 磷基底的方法。
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公开(公告)号：US10315285B2
公开(公告)日：2019-06-11
申请号：US15091275
申请日：2016-04-05
摘要： The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a substrate, such as a nickel-phosphorous substrate. The composition contains water, silica particles, a first alcohol comprising one or more of monohydric alcohol, polyhydric alcohol, and diglycol, a second alcohol in the form of polyvinyl alcohol, a nickel complexing agent, and optionally hydrogen peroxide, pH adjuster, and/or biocide. The method involves contacting the substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.
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